ISE Releases Powerful New TCAD Fab Package for Predictive Modeling on Applied Materials' Systems.

Business Editors/High-Tech Writers

SAN JOSE, Calif.--(BUSINESS WIRE)--June 18, 2001

Unique Collaborative Effort Enables Chipmakers to Predict the

Impact of Process Parameters on Chip Performance

for Ultra-Shallow Junction Formation

Integrated Systems Engineering (ISE), a leading supplier of software solutions to the semiconductor industry, today released its first TCAD Fab Package developed in collaboration with Applied Materials, Inc.

The TCAD(1) Fab Package is a powerful process and device simulation software that enables chipmakers to predict the effects of semiconductor manufacturing processes on device designs when using Applied Materials' ion implantation and RTP(2) systems.

"Historically, the lack of a consistent set of calibrated parameters prevented the industry from obtaining the accurate results necessary to take full advantage of TCAD modeling," said Dr. Klas Lilja, CEO of ISE. "Using the TCAD Fab Package, our customers can now get accurate information about process and device performance without expensive and time-consuming testing. Our collaboration with Applied Materials is the first complete calibration effort accomplished over a wide range of advanced sub-0.18 micron process conditions."

Unlike conventional process modeling software, this TCAD Fab Package is calibrated to specific Applied Materials' systems or integrated equipment sets, including ion implantation and RTP systems, for fabricating ultra-shallow junctions. Using the software, customers can quickly and accurately optimize process conditions to achieve specific device characteristics. The TCAD Fab Package can significantly reduce the time and cost of process development, eliminating lengthy system operation and numerous test wafers.

"The TCAD Fab Package enables fast, cost-effective optimization of process technology early in the development stage by reducing the number of iterations leading to production -- a capability that will be especially critical as the industry moves to more costly 300mm wafers," said Dr. Babak Adibi, senior director of Applied Materials' Parametric and Conductive Implantation Business Group. "This technology has tremendous potential to accelerate semiconductor manufacturing into a new level of productivity, allowing chipmakers to substantially accelerate their time to market with new products."

ISE's TCAD Fab Package uses an extensive Calibration Database with many types of process and device electrical data taken from Applied Materials' processing systems. This data is used to create calibrated TCAD simulations capable of accurately reproducing all of the required process parameters. The TCAD Fab Package contains Physical Model Templates and Generic Process Flows for 0.15 micron and 0.13 micron technologies that are suitable for immediate incorporation into the fab environment.

"Our work with ISE has already helped Applied Materials gain valuable insight into some technological issues which otherwise were not clearly understood," said Adibi. "Having this understanding has helped us more effectively plan our technology and equipment development."

The first TCAD Fab Package release, which models Ultra-Shallow Junctions (USJs), is calibrated to Applied Materials' ion implant and RTP technologies. In these processes, small changes in processing parameters, such as tilt angle or ion beam energy in implant or temperature ramp rate and peak temperature in RTP, can significantly impact semiconductor device performance. Customers for the software will receive additional expansion capabilities and updates created from the ongoing large-scale calibration efforts between ISE and Applied Materials.

About ISE

ISE AG is a leading provider of TCAD tools worldwide. ISE focuses on TCAD, and offers software solutions and consulting services for the world's largest semiconductor fabrication facilities. Founded in 1993, the company is privately held with headquarters in Zurich, Switzerland at Balgriststrasse 102, CH-8008 Zurich, and a subsidiary ISE, Inc. located in San Jose at 111 N. Market Street, Suite 800, San Jose, Calif. 95113. ISE's web site is http://www.ise.com.

Applied Materials (Nasdaq:AMAT), the largest supplier of products and services to the global semiconductor industry, is one of the world's leading information infrastructure providers. Applied Materials enables Information for Everyone(TM) by helping semiconductor manufacturers produce more powerful, portable and affordable chips. Applied Materials' web site is http://www.appliedmaterials.com.

(1) TCAD: Technology Computer Aided Design; simulation software used to model processes (2) RTP: rapid thermal processing