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IPC issues ENEPIG specs.

The IPC (1) (InterProcess Communication) The exchange of data between one program and another either within the same computer or over a network. It implies a protocol that guarantees a response to a request.  Plating Processes Subcommittee 4-14, co-chaired by George Milad and Gerard O'Brian, has finalized specifications for an ENEPIG Surface Finish, IPC-4556.

The electroless nickel thickness shall be 3 to 6 [micro]m [118.1 to 236.2 pin] at [+ or -] 4 sigma (standard deviations) from the mean as measured on a nominal pad size of 1.5 mm x 1.5 mm [0.060 in x 0.060 in] or equivalent area, where standard feature size tolerances as expressed in the IPC-6010 standard series, apply. The upper end of this thickness specification has been chosen based on concerns with insertion force issues for compliant pin applications only. Use of thicknesses outside of this range shall be AABUS.

The electroless palladium thickness shall be 0.05 to 0.15 pm [2 to 12 pin] at [+ or -] 4 sigma (standard deviations) from the mean as measured on a nominal pad size of 1.5 mm x 1.5 mm [0.060 in x 0.060 in] or equivalent area, where standard feature size tolerances as expressed in the IPC-6010 standard series, apply. The upper thickness limit may be exceeded to meet special design criteria Noun 1. design criteria - criteria that designers should meet in designing some system or device; "the job specifications summarized the design criteria"
criterion, standard - the ideal in terms of which something can be judged; "they live by the standards of their
 (for example, wire bonding Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.

The wire is generally made up of one of the following:
  • Gold
  • Aluminum
  • Copper
). However, the committee has data showing that excessive electroless palladium thicknesses may impair solder joint reliability.

The minimum immersion gold thickness shall be 0.025[micro]m [1.2 pin] at - 4 sigma (standard deviations) below the mean as measured on a nominal pad size of 1.5 mm x 1.5 mm [0.060 in x 0.060 in] or equivalent area, where standard feature size tolerances as expressed in the IPC-6010 standard series, apply. The specification is one sided, based on performance test results showing impaired solderability performance after accelerated aging Accelerated aging is a testing method used to estimate the useful lifespan of a product when actual lifespan data is unavailable. This occurs with products that have not existed long enough to have gone through their useful lifespan: for example, a new type of car engine or a new  at lower gold thicknesses. The nature of the reaction of immersion gold with electroless palladium is such that substantially greater thicknesses may not be achievable.

This important two-year effort saw major contributions from these OEMs: Raytheon, Lockheed Martin For the former company, see .

Lockheed Martin (NYSE: LMT) is a leading multinational aerospace manufacturer and advanced technology company formed in 1995 by the merger of Lockheed Corporation with Martin Marietta.
, Adtran, Boeing, BAE, Honeywell, Continental Automotive, Schneider Electric, Delphi, St. Jude Medical St. Jude Medical, Inc. NYSE: STJ is a $2.9 billion global cardiovascular device company, with headquarters in St. Paul, Minnesota, United States. The company sells products in more than 100 countries and has over 20 operations and manufacturing facilities worldwide. , RIM, Intel, HP and Oracle.

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Backplane Industry Proves Immersion Tin is Cleaner, Flatter, and 3x
Faster - and Ideally Suited for Press Fit Connectors

Attribute      Specification    Result           Performance
                                                 Rank

Ionic          IPCTM 650 1 54   0.8 NaCI         40% less than
Cleanliness    NaCI             micrograms/in2   the
               micrograms/in2                    specification

Thickness      IPC 554          46 and 52        Potential to
uniformity     Category 3       microinches      satisfy
               minimum 40       with a 1.5 St    category 3
               microinches      dev              requirements
               minus 4 sigma

Surface        Crystalline      Fine grain       Preferred fine
analysis       murphology       crystalline      grain deposit
                                deposit          resulting in
                                                 excellent
                                                 wettability

Solderaoility  EIA IPC          Wetting time     Wetting time
               J-STD-003C       0.68 sec as      improved with
                                plated 1.1 sec   bath age
                                alter heat
                                treat. Final
                                force over 0 2
                                mN/mm

Soldermask     No lift at tape  Average moan     Allows
undercut       test             2.5 micron less  potential for
                                than 0.1 mil     reworkability


The Round Robin Test Summary is available through IPC. The subcommittee's next task is to update the (2002) specifications for ENIG ENIG Electroless Nickel Immersion Gold (printed circuit board manufacturing process) .
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Publication:Printed Circuit Design & Fab
Date:Mar 1, 2013
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