IPC issues ENEPIG specs.IPC (1) (InterProcess Communication) The exchange of data between one program and another either within the same computer or over a network. It implies a protocol that guarantees a response to a request. Plating Processes Subcommittee 4-14, co-chaired by George Milad and Gerard O'Brian, has finalized specifications for an ENEPIG Surface Finish, IPC-4556.
The electroless nickel thickness shall be 3 to 6 [micro]m [118.1 to 236.2 pin] at [+ or -] 4 sigma (standard deviations) from the mean as measured on a nominal pad size of 1.5 mm x 1.5 mm [0.060 in x 0.060 in] or equivalent area, where standard feature size tolerances as expressed in the IPC-6010 standard series, apply. The upper end of this thickness specification has been chosen based on concerns with insertion force issues for compliant pin applications only. Use of thicknesses outside of this range shall be AABUS.
The electroless palladium thickness shall be 0.05 to 0.15 pm [2 to 12 pin] at [+ or -] 4 sigma (standard deviations) from the mean as measured on a nominal pad size of 1.5 mm x 1.5 mm [0.060 in x 0.060 in] or equivalent area, where standard feature size tolerances as expressed in the IPC-6010 standard series, apply. The upper thickness limit may be exceeded to meet special design criteria Noun 1. design criteria - criteria that designers should meet in designing some system or device; "the job specifications summarized the design criteria"
criterion, standard - the ideal in terms of which something can be judged; "they live by the standards of their (for example, wire bonding Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.
The wire is generally made up of one of the following:
The minimum immersion gold thickness shall be 0.025[micro]m [1.2 pin] at - 4 sigma (standard deviations) below the mean as measured on a nominal pad size of 1.5 mm x 1.5 mm [0.060 in x 0.060 in] or equivalent area, where standard feature size tolerances as expressed in the IPC-6010 standard series, apply. The specification is one sided, based on performance test results showing impaired solderability performance after accelerated aging Accelerated aging is a testing method used to estimate the useful lifespan of a product when actual lifespan data is unavailable. This occurs with products that have not existed long enough to have gone through their useful lifespan: for example, a new type of car engine or a new at lower gold thicknesses. The nature of the reaction of immersion gold with electroless palladium is such that substantially greater thicknesses may not be achievable.
This important two-year effort saw major contributions from these OEMs: Raytheon, Lockheed Martin For the former company, see .
Lockheed Martin (NYSE: LMT) is a leading multinational aerospace manufacturer and advanced technology company formed in 1995 by the merger of Lockheed Corporation with Martin Marietta. , Adtran, Boeing, BAE, Honeywell, Continental Automotive, Schneider Electric, Delphi, St. Jude Medical St. Jude Medical, Inc. NYSE: STJ is a $2.9 billion global cardiovascular device company, with headquarters in St. Paul, Minnesota, United States. The company sells products in more than 100 countries and has over 20 operations and manufacturing facilities worldwide. , RIM, Intel, HP and Oracle.
Backplane Industry Proves Immersion Tin is Cleaner, Flatter, and 3x Faster - and Ideally Suited for Press Fit Connectors Attribute Specification Result Performance Rank Ionic IPCTM 650 1 54 0.8 NaCI 40% less than Cleanliness NaCI micrograms/in2 the micrograms/in2 specification Thickness IPC 554 46 and 52 Potential to uniformity Category 3 microinches satisfy minimum 40 with a 1.5 St category 3 microinches dev requirements minus 4 sigma Surface Crystalline Fine grain Preferred fine analysis murphology crystalline grain deposit deposit resulting in excellent wettability Solderaoility EIA IPC Wetting time Wetting time J-STD-003C 0.68 sec as improved with plated 1.1 sec bath age alter heat treat. Final force over 0 2 mN/mm Soldermask No lift at tape Average moan Allows undercut test 2.5 micron less potential for than 0.1 mil reworkability
The Round Robin Test Summary is available through IPC. The subcommittee's next task is to update the (2002) specifications for ENIG ENIG Electroless Nickel Immersion Gold (printed circuit board manufacturing process) .