INCEP-R- Technologies Announces Innovative Power Delivery Technology, Agreement with HP.Business Editors/High-Tech Writers SAN DIEGO--(BUSINESS WIRE)--July 30, 2003 Industry Leverages INCEP INCEP Instituto Centroamericano de Estudios Políticos (Spanish) INCEP Interceptor Innovations in Modular Z-Axis Power Delivery for High Performance Processors and Microelectronic Devices INCEP Technologies Inc. announced today that it has signed an agreement with HP to develop power delivery technologies for use in high-performance systems that use Itanium(R) microprocessors, including HP's Integrity enterprise servers. INCEP is establishing a new standard with its microprocessor power delivery architecture, which combines the microprocessor die and its chip-carrier substrates with the microprocessor's power conditioning circuitry. The INCEP solution requires only a single heat dissipating device and retention solution for the co-packaged microprocessor and power supply. INCEP has developed a patented approach of applying power to the surface of a microprocessor package, which supports traditional pin grid array See PGA. (hardware) Pin Grid Array - (PGA) A style of integrated circuit socket or pin-out with pins laid out on a square or rectangular grid with a separation of 0.1 inch in each direction. The pins near the centre of the array are often missing. as well as land grid array The land grid array (LGA) is a type of surface-mount packaging used for integrated circuits. It can be electrically connected to a PCB either by the use of a socket or by soldering directly to the PCB. configurations. The solution also requires a high-performance power connector A power connector is an electrical connector designed to carry a significant amount of electrical power, usually as DC or low-frequency AC. Some types of RF connector may also carry large amounts of power, but are considered as a separate category. and a high-density DC/DC converter, which combine to deliver the necessary device power. This assembly is referred to as the ZVRM(TM) Assembly for computing applications, and the ZBrick(TM) Assembly for communication applications. High-density power and thermal solutions are expected to be a key differentiator in systems, especially those that feature z-axis power technologies such as the HP mx2 module. Under the terms of the agreement, INCEP has made its innovations in power delivery available to HP for multi-processor power modules, and will be working with HP over the next three years on enterprise server microprocessor power delivery applications. The INCEP technology will enable microprocessors to run over 200W at less than 1V. Due to the short path between the power supply and the device, the technology will support static device currents over 200A and dynamic currents over 5,000A/microsecond. The ZVRM and ZBrick Assemblies not only promise a performance roadmap that meets all device, power, and system performance requirements, but it also plans to deliver reductions in cost compared to alternatives of up to 50% for the voltage regulation Voltage regulation The change in voltage magnitude that occurs when the load (at a specified power factor) is reduced from the rated or nominal value to zero, with no intentional manual readjustment of any voltage control, expressed in percent of nominal circuitry, 16% for the device package, and over 20% on power delivery components at the system-level for the OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and . "Our relationship with HP, a leader in the computer system industry, further demonstrates the value of combined device and power delivery packaging," said Jim Hjerpe Kaskade, CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. and president of INCEP Technologies. "We believe it's only a matter of time before all high-power and high-performance computing High-speed computing, which typically refers to supercomputers used in scientific research. and communication applications utilize INCEP's modular z-axis power delivery architecture as a new standard for the industry." "HP delivers the best return on IT investment for our customers through a combination of internal invention and leveraging partnerships," said Paul Perez, HP's director of the High Performance Systems Laboratory. "INCEP's unique approach of power delivery to the device is focused in an area which is key to improving performance and density in systems." About INCEP Technologies INCEP has pioneered the concept of the combined CPU CPU in full central processing unit Principal component of a digital computer, composed of a control unit, an instruction-decoding unit, and an arithmetic-logic unit. and voltage regulation packaging beginning its work in 1998. The company develops high-performance direct-to-the-chip-package power delivery solutions leveraging its expertise in low impedance impedance, in electricity, measure in ohms of the degree to which an electric circuit resists the flow of electric current when a voltage is impressed across its terminals. power interconnect, high-density voltage regulation, device packaging and thermal management. The company is currently focused on microprocessor solutions with future targeted applications in communications. Additional information is available at www.incep.com This release contains forward-looking statements forward-looking statement A projected financial statement based on management expectations. A forward-looking statement involves risks with regard to the accuracy of assumptions underlying the projections. . Forward-looking statements are generally preceded by words such as "expects," "plans," "believes," "anticipates" or "intends." Statements in this release that are not historical are forward-looking and are subject to various risks and uncertainties that could cause actual results to vary materially from those stated. INCEP does not undertake to revise these forward-looking statements or to provide any updates regarding information contained in this release resulting from new information, future events or otherwise. |
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