INCEP Technologies Announces Manufacturing Relationship for Production of Its Z-axis Voltage Regulation Assemblies.Business Editors/High-Tech Writers SAN DIEGO--(BUSINESS WIRE)--Sept. 23, 2003 INCEP INCEP Instituto Centroamericano de Estudios Políticos (Spanish) INCEP Interceptor is Creating a Supply Chain Infrastructure to Source in High Volume INCEP(R) Technologies Inc. announced today that it has entered into a manufacturing agreement with Celestica, a world leader in electronics manufacturing services Electronic manufacturing services (EMS) is term used for companies that design, test, manufacture, distribute and provide return/repair services for electronic component and assemblies for original equipment manufacturers (OEMs). (EMS). INCEP will leverage Celestica's operations in Asia, Europe and the Americas to provide its OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and customers with industry-leading quality, technology and supply chain management -- enabling faster time-to-market, scalability and manufacturing efficiency. INCEP is working with Celestica to help manufacture its new microprocessor power delivery modules, which combine the microprocessor die and its chip-carrier substrates with the microprocessor's power conditioning circuitry. This assembly is referred to as the ZVRM(TM) Assembly for computing applications. The INCEP ZVRM DC/DC converter requires only a single heat dissipating device and retention solution for the co-packaged microprocessor and power supply. INCEP has developed a patented approach of applying power to the surface of a microprocessor package, which supports traditional pin grid array See PGA. (hardware) Pin Grid Array - (PGA) A style of integrated circuit socket or pin-out with pins laid out on a square or rectangular grid with a separation of 0.1 inch in each direction. The pins near the centre of the array are often missing. as well as land grid array The land grid array (LGA) is a type of surface-mount packaging used for integrated circuits. It can be electrically connected to a PCB either by the use of a socket or by soldering directly to the PCB. configurations. The solution also requires a high-performance power connector A power connector is an electrical connector designed to carry a significant amount of electrical power, usually as DC or low-frequency AC. Some types of RF connector may also carry large amounts of power, but are considered as a separate category. coupled with the high-density DC/DC converter, which combine to deliver the necessary device power. "In order to meet the demands of high-volume and high-reliability in the desktop and server markets, we felt that it was pivotal to partner with a well-established EMS provider," said Jim Hjerpe Kaskade, CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. and president of INCEP Technologies. "Our relationship with Celestica provides us an efficient instant supply capability that our customers trust." "Celestica is pleased to be working with INCEP Technologies in its development of new microprocessor power delivery systems," said Peter Lindgren, senior vice president, Celestica. "As a leader in the delivery of EMS and global supply chain management, Celestica brings technology innovation and low cost manufacturing to customers, enabling them to be price competitive in their marketplace." About INCEP Technologies INCEP has pioneered the concept of the combined CPU CPU in full central processing unit Principal component of a digital computer, composed of a control unit, an instruction-decoding unit, and an arithmetic-logic unit. and voltage regulation packaging, beginning its work in 1998. The company develops high-performance direct-to-the-chip-package power delivery solutions leveraging its expertise in low impedance power interconnect, high-density voltage regulation, device packaging, and thermal management. The company is currently focused on microprocessor solutions with future targeted applications in communications. Additional information is available at www.incep.com. |
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