IMAPS issues call for papers.IMAPS IMAPS IMAP (Internet Message Access Protocol) Secure IMAPS International Microelectronics And Packaging Society IMAPS Interstellar Medium Absorption Profile Spectrograph IMAPS Integrated Military Airlift Planning System (MAC) (Washington, D.C.) has issued a call for papers for the IMAPS Nordic Conference 2002, to be held September 29 to October 2, 2002, in Stockholm, Sweden. The abstract must be non-commercial in nature and submitted in electronic form to conference@imapsnordic.org no later than April 20, 2002. The deadline for the final paper is July 20, 2002. Proposed paper topics include: microelectronics applications; ceramics for future electronics; microvia, high-density interconnect (HDI HDI Human Development Index (UNDP yardstick of human welfare) HDI Help Desk Institute HDI Humpty Dumpty Institute (New York, New York) HDI High Density Interconnect ) laminates; chip-scale package (CSP), flip chips, area array packages; advanced interconnect; integrated passives and system in package (SP); lead-free and halogen free electronics; MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. , MOEMS See MEMS. and opto; and introducing new technologies to the production floor. For more information on the conference, or for a full list of suggested topics, visit http://www.imapsnordic.org |
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