ICOS Vision Systems and IMEC Collaborate on 3D Packaging Metrology.LEUVEN, Belgium -- ICOS Vision Systems Corporation NV (Nasdaq and Euronext: IVIS IVIS International Veterinary Information Service IVIS Interactive Video Information System IVIS Intervehicular Information System IVIS Inter-Vehicular Information System IVIS Integrated Vehicular Information System IVIS in Vehicle Information System ), a leading supplier of inspection solutions for the semiconductor industry and IMEC, a world-leading independent research center in nanoelectronics and nanotechnology, have agreed to work together under a two-year Joint Exploration and Development Program (JEDP JEDP Jahovist, Elohimist, Deuteronomist, Priestly (theory about authors of old testament) ), in the field of inspection and metrology for three dimensional (3D) packaging. According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. market analysts, the market for 3D packaging will grow rapidly over the next years, driven by the quest for Verb 1. quest for - go in search of or hunt for; "pursue a hobby" quest after, go after, pursue look for, search, seek - try to locate or discover, or try to establish the existence of; "The police are searching for clues"; "They are searching for the smaller and higher performance Integrated Circuits Integrated circuits Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1. (IC's). Research will be performed at the IMEC laboratories and ICOS will provide technology and equipment for inspection and metrology. The joint research program will concentrate on the development and optimization of several 3D packaging processes for IC's, including Wafer Level Packaging (WLP WLP WebLogic Portal (Bea Systems) WLP Wafer Level Packaging WLP Women's Learning Partnership (Bethesda, MD) WLP Workplace Learning & Performance WLP World Library Partnership, Inc. ), flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done , systems-in-a-package (SiP) and micro-electromechanical systems (MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. ) and on the optimization of the 3D metrology methods for these applications. The program will be closely connected to IMEC's industrial affiliation program (IIAP IIAP ISS Independent Assessment Panel ) on 3D stacked IC's. The IIAP program brings together the researchers of IMEC and of world-leading suppliers of IC's, to jointly develop the technologies of future generation products. "We are impressed with IMEC's research programs on semiconductor packaging and are delighted to join their international consortium," said Gust Smeyers, ICOS' Senior Vice President for Research and Development. "We look forward to working together with IMEC and the largest IC manufacturers around the world on the development of advanced 3D packaging processes. This program underscores our technical leadership in our field and our unrelenting commitment to invest in the technologies and products of the future." "Packaging is becoming an increasingly important part of semiconductor manufacturing and we are expanding our research efforts in the packaging field, including a large research program on 3D packaging," said Gilbert Declerck, CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. of IMEC. "We are delighted to work with ICOS on the advancements of the 3D packaging processes and the metrology tools that are needed." About ICOS Vision Systems ICOS designs and manufactures inspection equipment for the semiconductor packaging industry. It is a world-leading supplier of equipment for the final visual control of chips before they are used in various applications, such as PC's, cars or portable phones. ICOS' systems perform two- and three-dimensional (2D and 3D) metrology and inspection as part of the final visual quality control step in the manufacturing of chips, wafers, flexible tapes for flat panel displays, sockets, substrates and solar cells. Aside from its complete systems, ICOS also offers inspection modules for integration in other equipment. ICOS is headquartered in Leuven, Belgium and has R&D centers in Belgium, Germany and Hong Kong Hong Kong (hŏng kŏng), Mandarin Xianggang, special administrative region of China, formerly a British crown colony (2005 est. pop. 6,899,000), land area 422 sq mi (1,092 sq km), adjacent to Guangdong prov. and sales and support offices in Japan, the USA, Singapore, Hong Kong and Korea and production facilities in Belgium, Hong Kong and China. ICOS Vision Systems Corporation NV can be found on the World Wide Web at www.ICOS.be About IMEC IMEC is a world-leading independent research center in nanoelectronics and nanotechnology. Its research focuses on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC's research bridges the gap between fundamental research at universities and technology development in industry. Its unique balance of processing and system know-how, intellectual property portfolio, state-of-the-art infrastructure and its strong network of companies, universities and research institutes worldwide position IMEC as a key partner for shaping technologies for future systems. As an expansion of its wireless autonomous microsystems research, IMEC has created a legal entity in the Netherlands. Stichting IMEC Nederland runs activities at the Holst Centre, an independent R&D institute that develops generic technologies and technology platforms for autonomous wireless transducer transducer, device that accepts an input of energy in one form and produces an output of energy in some other form, with a known, fixed relationship between the input and output. solutions and systems-in-foil. IMEC is headquartered in Leuven, Belgium, and has representatives in the U.S., China and Japan. Its staff of more than 1450 people includes more than 500 industrial residents and guest researchers. In 2005, its revenue was EUR EUR In currencies, this is the abbreviation for the Euro. Notes: The currency market, also known as the Foreign Exchange market, is the largest financial market in the world, with a daily average volume of over US $1 trillion. 197 million. Further information on IMEC can be found on www.imec.be. "Safe Harbor Safe Harbor 1. A legal provision to reduce or eliminate liability as long as good faith is demonstrated. 2. A form of shark repellent implemented by a target company acquiring a business that is so poorly regulated that the target itself is less attractive. " Statement under the Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995: Certain matters discussed in this press release, such as the expected growth of the market for 3D packaging, the intended results of the Joint Exploration and Development Program and ICOS' product development plans and expectations regarding that collaboration, are forward-looking statements. These statements are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. Joint exploration and development programs involve numerous risks, including difficulties associated with cooperation and conflicts of interest among the parties. In addition, the technologies and products developed through the collaboration, as well as the anticipated market growth for 3D packaging, will be subject to the significant risks and uncertainties generally applicable to ICOS including: risks related to the evolution of the semiconductor and semiconductor equipment markets, including the cyclical nature of those markets and the uncertainty of market growth; the uncertainty of new product development, including the risk that newly introduced products may contain undetected errors or defects or otherwise not perform as anticipated; budget overruns; project delays; rapid technological change; competition; risks relating to intellectual property protection and ownership and associated litigation An action brought in court to enforce a particular right. The act or process of bringing a lawsuit in and of itself; a judicial contest; any dispute. When a person begins a civil lawsuit, the person enters into a process called litigation. ; as well as other risks set forth in ICOS' most recent annual report on form 20-F and other filings with the Securities and Exchange Commission. ICOS cautions readers not to place undue reliance upon any such forward-looking statements, which speak only as of the date made. ICOS expressly disclaims any obligation or undertaking to release publicly any updates or revisions to any such statements to reflect any change in ICOS' expectations or any change in events, conditions or circumstances on which any such statement is based. |
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