ICOS Vision Systems Introduces BWI-2300, A Stand Alone Bumped Wafer Inspection Machine, At SEMICON Taiwan 2001.Business & Technology Editors HEVERLEE, Belgium--(BUSINESS WIRE)--Sept. 18, 2001 The Company will also Demonstrate its New Tape Carrier Package Inspection Machine and the Latest Version of its CI-8450 Component Inspector ICOS Vision Systems Corporation N.V. (NASDAQ NASDAQ in full National Association of Securities Dealers Automated Quotations U.S. market for over-the-counter securities. Established in 1971 by the National Association of Securities Dealers (NASD), NASDAQ is an automated quotation system that reports on and NASDAQ Europe: IVIS IVIS International Veterinary Information Service IVIS Interactive Video Information System IVIS Intervehicular Information System IVIS Inter-Vehicular Information System IVIS Integrated Vehicular Information System IVIS in Vehicle Information System ), a world leader in vision solutions, today announced that it is demonstrating its new BWI-2300, new FTI FTI Free thyroxine index, see there 1200 MP tape carrier packaging inspection machine and the latest version of its CI-8450 component inspector at the SEMICON SEMICON Semiconductors Equipment and Material International Conference Taiwan 2001 trade show. SEMICON Taiwan is being held in Taipei, Taiwan between September 17 and September 19. ICOS is exhibiting its products at booth 1318 at the Taipei World Trade Center Taipei World Trade Center, TWTC, was started in January, 1986 by Taiwan's foremost trade promotion organization, the Taiwan External Trade Development Council (TAITRA), to provide a single, modern venue that would combine exhibition space, conference facilities, offices, and hotel . "By introducing these new products ICOS is broadening its addressable Reachable. When something is addressable, it can be identified and manipulated independently of its surroundings. For example, screen pixels and RAM memory are addressable. Each of the screen's picture elements can be individually turned on and off, and each of the memory's bytes can be market and expanding its range of offerings to both existing and potential customers," said Jos Verjans, president and chief executive of ICOS. "With the BWI-2300, an essential tool for wafer fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. process management and yield enhancement, we are entering an emerging market segment of the semiconductor industry, the bumped wafer market. With the FTI 1200 MP, which performs fully automated tape carrier package inspection, we are penetrating the emerging segment of the market for tape carrier package inspection. Finally, we are continuing to enhance the functionality and speed of the CI-8450, our fully automatic component inspector product line. "We remain committed to investing in product development to meet our customers' requirements for continuous productivity improvements and to introducing new products that meet the demand for emerging applications of machine vision solutions." BWI-2300 Specifically designed for the fully automated bump metrology measurement and defect detection of bumped wafers up to 300mm, the BWI-2300 system's capabilities include flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done and wafer level chip scale packages. Its inspection algorithms put the inspection intelligence in the system, where it should be, thereby enabling very reliable inspection results with a close to zero overkill overkill Vox populi An excess of anything . In contrast, other systems rely heavily on operator intervention to re-inspect results after system inspection. With an unmatched footprint of 1.155m x 1.010m, the BWI-2300 offers a compact and accurate bumped wafer inspection at high throughputs that delivers a rapid return on investment. It is equipped with an industry-standard robot that transfers the wafer from the wafer cassettes to the inspection station. In addition, the BWI-2300 simultaneously measures the bumps in 2D and 3D in a one-step process using a powerful combination of 2D and 3D inspection technologies and performs the active die inspection. Finally, the BWI-2300 provides for a wide range of bump inspections such as bump coplanarity In geometry, a set of points in space is coplanar if the points all lie in the same geometric plane. For example, three points are always coplanar; but four points in space are usually not coplanar. , bump height, bump width, bump position and bump pitch. Defect detection includes missing bumps, bump deformation, and defects on the active die area. The BWI-2300 has a user interface that takes full advantage of the latest release of ICOS' Man Machine Interface (MMI (Man Machine Interface) See HMI. 1. MMI - Man-Machine Interface. 2. (company) MMI - The company which developed the first Programmable Array Logic devices. MMI was bought by AMD. ), allowing for easy system set-up and machine operation; it comes with a wide range of statistical process control (SPC 1. (business) SPC - Statistical Process Control. Something to do with quality management. 2. (body) SPC - Software Productivity Centre. 3. (company) SPC - Software Publishing Corporation. 4. ) tools including wafer maps and histograms of summary data and individual measurements; and it utilizes ICOS' new, high-performance DSP-based MVS (Multiple Virtual Storage) Introduced in 1974, the primary operating system used with IBM mainframes (the others are VM and DOS/VSE). MVS is a batch processing-oriented operating system that manages large amounts of memory and disk space. 6000 board for inspection image analysis. FTI 1200 MP The FTI 1200 MP performs a fully automated optical inspection Automated Optical Inspection (AOI) is an automated visual inspection of PCB(or LCD,transistor manufacture) where a camera autonomously scans the device under test for both catastrophic failure (eg. missing component) and quality defects (eg. of Tape Carrier Packages (TCP (1) (Transmission Control Protocol) The reliable transport protocol within the TCP/IP protocol suite. TCP ensures that all data arrive accurately and 100% intact at the other end. ), components that are placed on tape and are often used in LCD monitors and detects an extensive range of lead defects, pattern defects, resin defects and solder resist defects. It is powered by ICOS' high-performance vision engine based on TMS TMS Transcranial Magnetic Stimulation (alternative medicine for depression) TMS Test Match Special (sports - cricket) TMS Texas Motor Speedway TMS Transportation Management System TMS Toyota Motor Sales (TM) signal-processor technology, which uses super high-resolution cameras and multi-color light emitting diodes (LEDs) for illumination. As a final step in TCP assembly, the FTI 1200 MP offers improved quality compared to human inspection. It is a stand-alone machine with winders for loading and unloading TCP reels and a fully automatic camera-based optical inspection system that includes a verification microscope and a punching unit for marking bad parts. The inspection results are documented in a detailed reel report including counters for all part classes and detailed defect descriptions. The user interface integrates machine control and inspection set-up on a single monitor screen which allows for real-time control of the machine status and all machine functions, and for easy and efficient changeovers. CI-8450 The CI-8450 has a newly developed dual pick and place head, which significantly increases throughput. There are three independent inspection stations that perform full inspection of a wide range of semiconductors such as Gull Wing, J-lead, BGA/CSP and leadless devices. These are: (1) the 3D STEREO/ Lead Inspection Module Station for 3D lead or ball inspection and between-balls inspection; (2) the Bottom Inspection Station for inspecting the bottom mark and bottom surface of the packages and the contacts of leadless devices which also looks for burrs and slivers on the complete lead length of Gull Wing devices; and, (3) the Top Inspection Station that checks the top mark and the top package surface of the device and looks for burrs/slivers on the package edge. The CI-8450 is also available with a taper in which case the Top Inspection Station is used for final in-tape inspection. Discover these and other exciting new ICOS developments at SEMICON Taiwan, Taipei World Trade Center, booth No. 1318, Taipei, Taiwan. ICOS is a leading worldwide developer and supplier of machine vision and inspection solutions primarily for use in the back-end semiconductor manufacturing and electronic assembly industries. The Company's two- and three-dimensional inspection products are used worldwide to inspect integrated circuits at various stages of their manufacturing process and to align electronic components and printed circuit boards. The Company has three product lines: board-level products to be integrated in die-bonding equipment and in pick-and-place machines, system-level products to be integrated in testhandlers, molding equipment, trim-and-form equipment, marking systems and tape-and-reel equipment as well as for applications in other sectors such as the automotive sector and finally stand-alone component inspection systems. ICOS' headquarters are located in Heverlee, Belgium and it has sales and support offices in Japan, in the USA, Singapore, Hong Kong, Korea and Taiwan. The German subsidiary is, besides its sales and support function, also active as an R&D center. ICOS Vision Systems Corporation N.V. can be found on the World Wide Web at www.icos.be |
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