ICOS Vision Systems Introduces `OneCam 3D STEREO' OEM Module At SEMICON West 2001.

Business Editors

HEVERLEE, Belgium--(BUSINESS WIRE)

July 19, 2001 -

The Company will also Demonstrate its Latest Versions of Component

Inspectors and some of its ICOS6000 OEM products

ICOS Vision Systems Corporation N.V. (NASDAQ and NASDAQ Europe: IVIS), a world leader in vision solutions, today announced that it will demonstrate at the SEMICON West 2001 trade show its new OneCam 3D STEREO inspection module, its latest Component Inspector products and some of the ICOS6000 OEM products.

SEMICON West will be held in San Jose, California, on July 18, 19 and 20. ICOS will exhibit its products at booth no. 12050 of McEnery Hall.

OneCam 3D STEREO

The OneCam 3D STEREO, the latest addition to the ICOS6000 product line and the newest version of the Company's successful 3D STEREO OEM inspection module, performs 3D inspection of BGA, CSP, Gull Wing and J-lead devices. The new module incorporates several hardware changes compared to the 3D STEREO version. Only one camera is needed for 3D-coplanarity inspection, which significantly reduces the size of the module and makes it one of the most compact modules on the market. A newly designed camera revolver head containing different lenses, allows for a wide range of inspection from 10x10mm CSPs up to 47x47mm BGAs without requiring any hardware changeover and guarantees an optimal field of view (FOV) per component. Furthermore, the module is factory-calibrated and supports the measurement of multiple BGA, CSP and Gull Wing devices in one FOV for optimal throughput.

Jos Verjans, President and Chief Executive Officer, said "The OneCam 3D STEREO is another leading edge product that will help us expand our market share. Along with the introduction of the ICOS6000 product line at SEMICON Singapore last May and further improvements to our Component Inspector products, the OneCam 3D STEREO module will give us an even greater head start when the market recovers."

ICOS6000

ICOS6000 is the brand name for the enhanced System Level product line. System Level products are complete inspection subsystems offered for integration with Original Equipment Manufacturers, primarily in the semiconductor back-end markets. ICOS will exhibit several products in the new product line, including the 3D STEREO and diverse LIM (Lead Inspection Module) systems. In addition, all OEM inspection modules will gradually become available with the ICOS6000 rack, which contains a new DSP-based vision board that delivers faster and more accurate inspections.

ICOS' Component Inspector products

ICOS will demonstrate its high speed Component Inspector machines, including an enhanced CI-8450 and the CI-5250, a very flexible, mid-range capacity, stand-alone machine for the inspection of finished components.

CI-5250

The CI-5250 inspects Gull Wing, J-Lead, BGA and CSP devices with a wide range of inspections such as 2D and 3D lead or ball inspection, as well as mark and surface inspection. It has two configurations: one for QA/QC inspection and another for small- to medium-sized production volumes.

Two stations perform the inspections in parallel: a fixed station for lead and burr inspection (or ball inspection) and a mobile station for surface and mark inspection. The CI-5250 accepts a single tray, a tray stack or a tube on its input side and on its output side, trays or tape. With the taping-only configuration, the CI-5250 will handle basic tray-to-tape media transfer as well as de-taping applications.

CI-8450

The CI-8450, which has a newly developed dual pick and place head, is the latest and fastest addition to ICOS' stand alone, fully automatic Component Inspector product line. With the new dual pick and place head, ICOS significantly increases the throughput of the CI-8450.

Three independent inspection stations perform full inspection of a wide range of semiconductors such as Gull Wing, J-lead, BGA/CSP and leadless devices. These are (1) the 3D STEREO/LIM (Lead Inspection Module) Station for 3D lead or ball inspection and between-balls inspection; (2) the Bottom Inspection Station for inspecting the bottom mark and bottom surface of the packages and the contacts of leadless devices which also looks for burrs and slivers on the complete lead length of Gull Wing devices; and, (3) the Top Inspection Station that checks the top mark and the top package surface of the device and looks for burrs/slivers on the package edge. The CI-8450 is also available with a taper in which case the Top Inspection Station is used for final in-tape inspection.

Discover these and other exciting new ICOS developments at SEMICON West, McEnery Hall, booth No. 12050, San Jose, California.

ICOS is a leading worldwide developer and supplier of machine vision and inspection solutions primarily for use in the back-end semiconductor manufacturing and electronic assembly industries. The Company's two- and three-dimensional inspection products are used worldwide to inspect integrated circuits at various stages of their manufacturing process and to align electronic components and printed circuit boards. The Company has three product lines: board-level products to be integrated in die-bonding equipment and in pick-and-place machines, system-level products to be integrated in testhandlers, molding equipment, trim-and-form equipment, marking systems and tape-and-reel equipment as well as for applications in other sectors such as the automotive sector and finally stand-alone component inspection systems. ICOS' headquarters are located in Heverlee, Belgium and it has sales and support offices in Japan, in the USA, Singapore, Hong Kong, Korea and Taiwan. The German subsidiary is, besides its sales and support function, also active as an R&D center.

ICOS Vision Systems Corporation N.V. can be found on the World Wide Web at www.icos.be