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IC ball bonder.

The Max[mu]mplus ultra high speed ball bonder is for all types of ultra-fine pitch applications, including 35 micron in-line pitch. The bonder delivers bond placement accuracy of 2.5 [micro]m. An improved servo An electromechanical device that uses feedback to provide precise starts and stops for such functions as the motors on a tape drive or the moving of an access arm on a disk.  control system for the xy table reduces wire cycle times to 63.0 msecs. Performance is maintained for a bonding area of 56 X 66 mm (2.20 X 2.60 in.), and precision-touch bondhead technology delivers bond force control. Teaching and calibration software improves overall accuracy to 2.5[micro]m. The bonder also incorporates a reduced-friction wire feed path with the capability to handle wires down to 15[micro]m diameter. It also features advanced imaging technology, a [micro]T Sontics transducer transducer, device that accepts an input of energy in one form and produces an output of energy in some other form, with a known, fixed relationship between the input and output.  to minimize pad disturbance and a precision-arc embedded fiber optic (EFO EFO Eddie from Ohio (Virginia pop folk band)
EFO Executive Fire Officer
EFO Efficient Fiber Optics
EFO Errors Freaks and Oddities (philately)
EFO Earnings from Operations
EFO Emergency Field Office
) system that enhances electronic ball control delivery and provides high repeatability in free air ball formation.


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Kulicke & Soffa (K&S), Willow Grove Willow Grove may refer to:
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  • Willow Grove (SEPTA station), station on the SEPTA R2 line
  • Willow Grove Cemetery, New Brunswick, New Jersey, United States
, PA
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Title Annotation:Product Spotlight
Publication:Circuits Assembly
Date:May 1, 2004
Previous Article:Flux-coated solder preforms.
Next Article:Wire bond encapsulant.

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