IC ball bonder.
The Max[mu]mplus ultra high speed ball bonder is for all types of
ultra-fine pitch applications, including 35 micron in-line pitch. The
bonder delivers bond placement accuracy of 2.5 [micro]m. An improved
servo control system for the xy table reduces wire cycle times to 63.0
msecs. Performance is maintained for a bonding area of 56 X 66 mm (2.20
X 2.60 in.), and precision-touch bondhead technology delivers bond force
control. Teaching and calibration software improves overall accuracy to
2.5[micro]m. The bonder also incorporates a reduced-friction wire feed
path with the capability to handle wires down to 15[micro]m diameter. It
also features advanced imaging technology, a [micro]T Sontics transducer to minimize pad disturbance and a precision-arc embedded fiber optic
(EFO) system that enhances electronic ball control delivery and provides
high repeatability in free air ball formation.
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Kulicke & Soffa (K&S), Willow Grove, PA