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IBM Japan transfers SLC business to Kyocera.


Kyocera Corp. (Kyoto, Japan, www.kyocera.co.jp) and IBM (International Business Machines Corporation, Armonk, NY, www.ibm.com) The world's largest computer company. IBM's product lines include the S/390 mainframes (zSeries), AS/400 midrange business systems (iSeries), RS/6000 workstations and servers (pSeries), Intel-based servers (xSeries)  Japan Ltd. (Tokyo, Japan, www.ibm.com/jp) have reached an agreement for the transfer from IBM to Kyocera of the surface laminar laminar /lam·i·nar/ (lam´i-nar)
1. pertaining to a lamina or laminae.

2. laminated.

3. of, pertaining to, or being a streamlined, smooth fluid flow.
 circuitry (SLC (Subscriber Loop Carrier) Lucent's designation for its digital loop carrier (DLC) products. See digital loop carrier. See also 386SLC. ) business of the Yasu Site of IBM Japan

Kyocera will incorporate a new successor company at the Yasu Site, which will undertake the operation on of the transferred laminated high-density printed circuit board business.

With the increased demand for high quality and expanded functionality in communications equipment, semiconductors and electronic devices used in such equipment Will be required to accommodate higher speeds and the integration of multiple functions, high density, more reliable chip carriers and substrates made from ceramic and organic materials.

As a result of the business transfer, Kyocera will enhance its organic circuit board business through synergistic effects Synergistic effect

A violation of value-additivity in that the value of a combination is greater than the sum of the individual values.
 among its range of technologies covering materials, products and analysis and the SLC technologies, encompassing design manufacturing engineering Manufacturing engineering

Engineering activities involved in the creation and operation of the technical and economic processes that convert raw materials, energy, and purchased items into components for sale to other manufacturers or into end products for
 and packaging technology, of IBM Japan.
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Title Annotation:Asia Watch
Publication:Circuits Assembly
Article Type:Brief Article
Date:Sep 1, 2003
Words:159
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