Printer Friendly

IBM HONORS EMPLOYEES FOR TECHNICAL ACHIEVEMENT, NAMES NEW IBM FELLOW

 IBM HONORS EMPLOYEES FOR TECHNICAL ACHIEVEMENT, NAMES NEW IBM FELLOW
 SAN FRANCISCO, June 3 /PRNewswire/ -- IBM Corporation (NYSE: IBM) last night celebrated the technical achievements of its employees here by naming a new IBM Fellow, the company's highest technical honor, and by presenting more than $1.1 million in cash awards to 30 of its top technologists.
 IBM Chairman John F. Akers announced the appointment of Bernard S. Meyerson of IBM's Thomas J. Watson Research Center, Yorktown Heights, N.Y., as an IBM Fellow.
 Selected based on sustained technical achievement, IBM Fellows can pursue research and technical projects of their own choosing for at least five years. Since the program began in 1963, only 122 people have been designated IBM Fellows -- among them, five Nobel Prize laureates.
 Meyerson, an expert in the field of material growth and processing, pioneered the low-temperature epitaxy method that has significantly extended the performance of silicon technology. He was also one of the pioneers of the application of diamond-like carbon as a coating in IBM's semiconductor and storage technologies.
 The more than $1.1 million in awards to many of IBM's foremost scientists, engineers and programmers were made in two categories: Corporate Patent Portfolio Awards, which recognize inventors whose patents significantly enhance the value of IBM's patent portfolio, and Corporate Awards, which recognize individuals who made unique technical contributions of high value to IBM, science or technology.
 The largest Corporate Patent Portfolio Award was given to John Cocke and Norman H. Kreitzer of IBM's Thomas J. Watson Research Center, Hawthorne, N.Y., and George Radin of IBM's Santa Teresa Laboratory in San Jose, Calif. The three shared $120,000 for their patent covering the basic hierarchical memory system for the Reduced Instruction Set Computer (RISC). This innovative system greatly minimizes a processor's "idle" time as a result of reduced storage access and has been essential in positioning IBM's RISC System/6000 family of workstations in the marketplace.
 Two other Corporate Patent Portfolio Awards were given in recognition of the substantial licensing value associated with the following patents:
 -- A broadly used method for converting spatially related data (column and row data from spreadsheets) into a text processing format. This allows spreadsheet data to be inserted into text documents and simultaneously edited.
 -- A unique architecture which enables extremely fast and iterative digital signal processing. The architecture has wide application in multimedia data processing.
 The largest Corporate Awards were presented to the following two teams:
 -- A $175,000 award was shared by R. William Hay and J. Kevin O'Brien of IBM Canada, Toronto, and Martin E. Hopkins and Daniel A. Prener of IBM's Thomas J. Watson Research Center, Hawthorne, N.Y., for developing IBM's TOBEY optimizing compiler technology. TOBEY, developed for the RISC System/6000 family of workstations, solves the problem of producing efficient compiled programs across a range of compiler languages. TOBEY represents a significant advance in the state of the art of optimizing compilers, and the quality of its compiled code has set a new industry standard.
 -- L. Wynn Herron, John U. Knickerbocker, Ananda H. Kumar and Rao R. Tummala of IBM's East Fishkill, N.Y., facility jointly received $175,000 for pioneering the use of glass ceramic materials for multilayer, multichip substrates. Glass ceramic substrates feature a significantly improved dielectric constant and conductor which provide improved performance over their multilayer ceramic substrate predecessor. The technology is one of the key contributors to the IBM Enterprise System/9000's competitive performance.
 Other Corporate Awards were presented for these important contributions:
 -- Conception and development of the Wafer Level Recording Head Test, which allows detection of unstable signal behavior in thin-film recording heads while still at the wafer level. Identifying defects at this early stage of the direct access storage device (DASD) manufacturing process substantially reduces the cost of reworking head assemblies.
 -- Development of the highly innovative Application System/400 N-Way Architecture, which allows IBM AS/400 multiprocessors to execute in parallel while maintaining a "single image" for the user. The invention achieves maximized system performance with minimal software changes.
 -- Development of SOCRATES, a unique production planning tool that draws on advanced operation research principles. SOCRATES enables different logic chips to be efficiently customized on the same wafer, while minimizing the impact of variations in manufacturing yields.
 -- Design and implementation of Improved Data Recording Capability (IDRC). This invention consists of a logic card and microcode, which together provide greater tape drive recording capacity and performance through data compaction and blocking.
 -- Development of the gallium aluminum arsenide/gallium arsenide heterojunction, which makes possible the highly efficient transformation of light into electricity and vice versa. This achievement has opened new areas of semiconductor research and led to the creation of new optoelectronic devices, such as injection lasers, light-emitting diodes and photodetectors used in optical storage and communications devices, and to the development of highly efficient solar cells.
 -- Development of the Harmonic-Ratio-Flyheight (HRF) measurement method, which has been instrumental in ensuring the long-term reliability of IBM DASD products. With HRF, the absolute distance between a recording head and disk can be measured and disk surface defects detected in fully assembled disk files.
 -- Development of Chemical Mechanical Planarization (CMP) technology, a method of creating smooth and level surfaces at various steps in semiconductor chip manufacturing. Such surfaces are critical to improving the yield and reliability of multilevel chip interconnections and permit increased device density and performance.
 -0- 6/3/92
 /CONTACT: Jon C. Iwata of IBM, 914-765-6630/
 (IBM) CO: International Business Machines Corporation ST: New York IN: CPR SU:


GK -- NY022 -- 6551 06/03/92 10:16 EDT
COPYRIGHT 1992 PR Newswire Association LLC
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 1992 Gale, Cengage Learning. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Publication:PR Newswire
Date:Jun 3, 1992
Words:925
Previous Article:SCHNEIDER (USA) ANNOUNCES EXECUTIVE APPOINTMENTS
Next Article:GENERAL MOTORS APPOINTS COLLIN GENERAL DIRECTOR OF MARKET DATA CENTER
Topics:


Related Articles
U.S. SECRETARY OF LABOR PRESENTS IBM AUSTIN WITH HEALTH AND SAFETY AWARD
IBM LAUNCHES PREMIER BUSINESS PARTNER PROGRAM
IBM AWARDS OS/2 GOLD AMBASSADOR HONORS
IBM OS/2 2.0 NAMED SOFTWARE 'PRODUCT OF THE YEAR' BY DATAMATION; RECEIVES INTERNATIONAL RECOGNITION FOR TECHNICAL EXCELLENCE
Alliance@IBM/Communications Workers of America Questions IBM Claim of Adding 10,000 Jobs in 2004.
Answerthink Wins IBM Americas Business Partner Leadership Award.
Element K to Develop and Distribute Training for Developers on IBM's Lotus, Workplace and Collaboration Products.

Terms of use | Copyright © 2016 Farlex, Inc. | Feedback | For webmasters