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IBM AND IRVINE SENSORS TEAM UP TO COMMERCIALIZE 3-D SEMICONDUCTOR "CUBING" TECHNOLOGY

IBM AND IRVINE SENSORS TEAM UP TO COMMERCIALIZE 3-D SEMICONDUCTOR "CUBING"
 TECHNOLOGY
 COSTA MESA, Calif., June 15 /PRNewswire/ -- International Business Machines Corporation (NYSE: IBM) and Irvine Sensors Corporation (NASDAQ: IRSN) today announced the signing of a joint development agreement to commercialize Irvine Sensors' innovative chip-stacking ("cubing") technology.
 IBM and Irvine Sensors will work together to develop cubed products and the manufacturing technologies required to produce them in volume and at reasonable cost. The agreement contemplates a continuing relationship in which Irvine Sensors will support various advanced product activities for IBM, and IBM will provide components and manufacturing support to Irvine.
 The joint development work will take place at both IBM and Irvine Sensors facilities and involve technical employees from the two companies. Specific terms and conditions of the agreement were not disclosed.
 Cubing is a way of building three-dimensional, monolithic semiconductor devices called "cubes." These devices can be built from a stack of dozens of memory or logic chips or combinations of both. Cubes offer a higher level of integration, faster processing speeds and lower power requirements than today's chip sets.
 "We are delighted that our first commercial partner is IBM since we believe they have the world's most advanced production technologies and we have the world's highest density packaging technology," said James Alexiou, president of Irvine Sensors.
 "We are pleased to be working with Irvine Sensors," said Orest Bilous, assistant general manager, semiconductor manufacturing & process development, IBM Technology Products. "Through the unique strengths of our two companies, we will together create the technologies for more compact, powerful and rugged computing systems."
 Irvine Sensors, headquartered in Costa Mesa, is primarily engaged in the development of infrared devices and high-density packages of computer electronics which are intended to have broad applications in military and electronics systems.
 -0- 06/15/92
 CONTACT: Jon Iwata of IBM, 914-765-6630, or John Stuart of Irvine Sensors, 714-549-8211
 (IBM IRSN) CO: INTERNATIONAL BUSINESS MACHINES CORP.; IRVINE SENSORS
 CORP.


IN: CPR ST: NY,CA -- NY015 -- X369 06/15/92
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Publication:PR Newswire
Date:Jun 15, 1992
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