IBM, NTK Ink Deal to Increase Ceramic Substrate Supply.Business/Technology Editors EAST FISHKILL, N.Y. & AICHI, Japan--(BUSINESS WIRE)--Nov. 13, 2000 IBM (International Business Machines Corporation, Armonk, NY, www.ibm.com) The world's largest computer company. IBM's product lines include the S/390 mainframes (zSeries), AS/400 midrange business systems (iSeries), RS/6000 workstations and servers (pSeries), Intel-based servers (xSeries) and NTK NTK Need To Know NTK Nice to Know NTK Näringslivets Telekoförening (Swedish) NTK Newton Toolkit Technical Ceramics, a division of NGK NGK Nederlandse Gereformeerde Kerk (Dutch Reformed Church; South Africa) NGK New Greek NGK Nihon Gaishi Kaisha (NGK Insulators, Ltd. Nagoya, Japan) Spark Plug spark plug: see ignition. spark plug Device that fits into the cylinder head of an internal-combustion engine and carries two electrodes separated by an air gap, across which current from a high-tension ignition system discharges, creating a spark Co., LTD LTD 1 Laron-type dwarfism 2 Leukotriene D 3 Long-term depression, see there 4. Long-term disability ., today announced a multi-year agreement in which NTK will supply IBM with added capacity for the production of ceramic substrate chip carriers. Together with internal capacity expansions previously announced by IBM, the agreement is expected to more than triple IBM's supply of the packaging substrate by mid-2001. Terms of the agreement were not disclosed. "IBM has seen an unprecedented increase in demand for its leading edge ceramic substrate packaging technologies," said John Acocella, general manager of interconnect (1) To attach one device to another. (2) A physical port (plug, socket) or wireless port (transmitter, receiver) used to attach one device to another. products, IBM Microelectronics Division. "We are driving productivity improvements and capacity expansion at our existing facilities. Now, with additional support from NTK, we're working to further maximize our ceramic substrate production to meet our customers' needs." Under the agreement, NTK will manufacture ceramic chip carriers fabricated fab·ri·cate tr.v. fab·ri·cat·ed, fab·ri·cat·ing, fab·ri·cates 1. To make; create. 2. To construct by combining or assembling diverse, typically standardized parts: with alumina alumina (əl  `mĭnə) or aluminum oxide, Al2O3, chemical compound with m.p. about 2,000°C; and sp. gr. about 4.0. dielectric dielectric (dī'ĭlĕk`trĭk), material that does not conduct electricity readily, i.e., an insulator (see insulation). A good dielectric should also have other properties: It must resist breakdown under high voltages; it should not insulation and metallic conductors. These chip carriers are primarily used in high performance applications like networking gear and Web servers that require high I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output density, uniform chip power distribution, improved cooling capability, and high reliability. "NTK is ramping up ceramic packaging capacity for IBM immediately, using existing facilities," said Seiji Haga, executive worldwide vice president, NTK/NGK. "In addition, we began construction on a new manufacturing facility in August that is expected to begin production early in the second quarter of 2001. Together with IBM, NTK is committed to providing the high-performance chip packaging solutions needed to support the growth of the e-business environment." The agreement between IBM and NTK supplements the significant investments made this year by IBM to increase internal capacity for its packaging products. Investments have been made at its existing East Fishkill and Endicott, NY and Yasu, Japan facilities, as well as a proposed new $300 million organic packaging manufacturing facility in Shanghai, China. IBM's advanced packaging technologies have been used to build some of the highest density electronic components in the industry. Advances in IBM's ceramic packaging technology have led to increased packaging density, data bandwidths and operating frequencies while reducing system-level noise. IBM is one of the industry's foremost suppliers of interconnect products and services, enabling a full spectrum of applications through packaged semiconductors to fully tested electronic assemblies. IBM semiconductor packaging products are designed to support very high-frequency, high-bandwidth requirements being driven by the Internet while providing unmatched performance and dependability. About IBM Microelectronics IBM Microelectronics is a key contributor to IBM's role as the world's premier information technology supplier. IBM Microelectronics develops, manufactures and markets state-of-the-art semiconductor and interconnect technologies, products and services. Its superior integrated solutions can be found in many of the world's best-known electronic brands. More information about IBM Microelectronics can be found at: http://www.chips.ibm.com. About NTK NTK Technical Ceramics, a division of NGK Spark Plug Co., LTD., is a premiere manufacturer of Ceramic Packages around the globe for over 30 years with a business philosophy to achieve total customer satisfaction. The strength of NTK is technological development capability to meet diversed needs of world wide semiconductor and communication industries. NTK is now offering Organic Packages along with the award winning Ceramic Packages, and its packaging technology quality. More information about NTK can be located at http://www.ngkntk.co.jp/ |
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