Hymite Optical Subassembly Packages Offer Cost Savings Through Wafer-Level Assembly, Test and Burn-In.COPENHAGEN -- Conformant HyShell Data(TM) Housing Enables Added Functionality, Reduced Cost Hymite, a manufacturer of innovative wafer-level photonic and MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. packaging products, will show at the OFC OFC Office OFC Officer OFC Of Course OFC Oxygen Free Copper OFC Oceania Football Confederation (soccer) OFC Optical Fiber Cable OFC Optical Fiber Communications OFC Optical Fiber Conference its cost-effective small silicon housings for telecomms and datacomms optical sub assemblies (OSAs). The products are now being designed into high-speed applications at up to 10 Gigabits per second, answering market demand for higher-performance, smaller and lower-cost optical transceivers such as the 10Gbit/sec XFP XFP 10 Gigabit Small Form Factor Pluggable Module XFP Extra-Fine-Pitch XFP Ten Gigabit Small Form Factor Pluggable . Hymite's SMT (1) (Surface Mount Technology) See surface mount. (2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software. SMT - Station Management and Flex compatible optical packages are designed to replace expensive, labor-intensive configurations such as the commonly used "TO can", "butterfly" and DIL DIL - Dual In-Line Package packages. They easily meet the market's needs for MSA (Metropolitan Service Area) An urban area with at least 50,000 people plus surrounding counties. There are 306 MSAs and 428 RSAs (rural service areas) in the U.S. MSAs and RSAs are used to allocate cellular licenses. (Multi-Source Agreement)-compliant modules with an even smaller footprint. For instance the XMD-MSA was created to enable compatible sources of transmitter optical sub-assembly (TOSA Tosa Historic region of the Japanese island of Shikoku. It dates at least to the Heian period, when Ki no Tsurayuki (868?–945?), editor of Japan's first imperially commissioned poetry anthology, wrote a fictional diary drawing on his experiences as governor of Tosa. ) and receiver optical sub-assembly (ROSA) devices embedded in the 10-Gbit/sec XFP MSA module. Hymite's SMT and Flex packages shrink the footprint further. "The optical datacom and telecomm industry faces a challenge in reducing packaging cost and size," said Jochen Kuhmann, VP and CTO (Chief Technical Officer) The executive responsible for the technical direction of an organization. See CIO and salary survey. of Hymite A/S. "Exceeding industry specifications and standards is one key to Hymite's strategy. The other is to offer the customer impressive cost reductions through automated high-volume manufacture based on wafer-level assembly, burn-in and test." Hymite's small, cost-effective optical sub-assembly HyShell(TM) is proprietary and based on standard silicon micromachining processes. It is available at various levels of integration, from silicon submount to fully assembled ROSA and TOSA, to address telecom and datacom needs. VCSELs, Edge-Emitter lasers, PD and APD APD atrial premature depolarization (see atrial premature complex, under complex ); pamidronate. devices can be hermetically housed in Hymite's custom and reference silicon packages incorporating integrated passives, driver and trans-impedance-amplifiers and monitor pin-diodes. The silicon housing displays excellent thermal conduction characteristics for efficient heat dissipation, maintaining a cooler environment for consistent performance of optoelectronic devices in ever constricting enclosures. All HyShell packages support existing transmission speeds currently deployed in data transmission systems. The excellent RF performance of Hymite's vias enable scalability of up to 40Gbit/sec. HyShell is a hermetic package that meets Telcordia GR-468-Core and GR-1221-Core specifications. About Hymite Hymite A.S. is a leading provider of packaging solutions for the data communications, telecommunications, and MEMS industries. Its products and technology dramatically reduce the overall cost and size of optical components and systems through innovative package design, component integration and wafer-level assembly, test and burn-in. Hymite is privately held. Further information can be obtained from the company's website at www.hymite.com . |
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