Hymite A/S Announces Innovative Silicon-Based Packaging Solution for High-Volume Production of High-Brightness LEDs at Low Cost.Proven IC-Style Production and Assembly Meets Demanding Thermal and Size Requirements COPENHAGEN, Denmark & DALLAS -- Danish-German technology company Hymite A/S, an innovative supplier of advanced wafer level packaging products for electronics, micromechanical and optoelectronics components, today announced HyLED([TM]), a silicon-based packaging solution for high-brightness light emitting diodes See LED. (HB LEDs) in multiple markets. HyLED[TM] enables component miniaturization min·i·a·tur·ize tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es To plan or make on a greatly reduced scale. min , cost-effective manufacture and deployment of HB LED products across key industries where demand is high, from general lighting to mobile electronics, automotive lighting
n. A type of spotlight, used in photography, that illuminates a subject from behind. tr.v. back·light·ed or back·lit , back·light·ing, back·lights . A major European customer, which develops and produces high-performance digital light sources, is using HyLED[TM] for its cutting-edge light source product and has achieved significant package miniaturization and power efficiencies. "The primary challenge for HB LED manufacturers has been miniaturization and mass production of the components to meet market needs, while addressing unique thermal requirements and reducing the cost per lumen," said Jochen Kuhmann, CTO (Chief Technical Officer) The executive responsible for the technical direction of an organization. See CIO and salary survey. and founder, Hymite A/S. "HyLED[TM] silicon packaging overcomes these obstacles through wafer-scale production and assembly. We see a major market opportunity for significant enhancement of HB LEDs for widespread applications and markets." The technology behind HyLED[TM] is silicon wafers and batch micromachining/metallization processes delivering package size reductions of up to 4x. Proven IC-style automated manufacturing processes increase throughputs and yields for a lower cost per unit. The option of wafer level assembly and testing for the end-customer introduces huge cost benefits in this high-volume price sensitive consumer sector. Additionally, silicon has excellent inherent thermal management characteristics. Hymite's engineers provide optimized designs alleviating thermal and thermo-mechanical stress for excellent performance, even for the most demanding operation conditions. Unlike other package technologies, the micromachined LED cavity acts as a reflector reflector: see telescope. , thermal conductor and reservoir for silicone silicone, polymer in which atoms of silicon and oxygen alternate in a chain; various organic radicals, such as the methyl group, CH3, are bound to the silicon atoms. . About Hymite Hymite is a technology leader of silicon-based wafer level packaging for MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. , electronics and optoelectronics products. The products and technologies Hymite offers significantly reduce cost/performance ratio for packaging of components and systems through innovative designs, component integration and wafer-level assembly and testing. Further information can be obtained from the company's website at www.hymite.com. |
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