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High-speed wire bonder.


BondJet BJ915 heavy wire bonder reportedly offers high speed and accuracy, and a work area of 15 x 19.6". Highlights are said to include bonding speeds reported as fast as 450 ms/wire (300 [micro]m diameter 8 mm loop length wire) and 10 [micro]m at 3[sigma] placement accuracy. Said to be the only heavy wire bonder with both integrated pull test and nondestructive non·de·struc·tive  
adj.
Of, relating to, or being a process that does not result in damage to the material under investigation or testing.



non
 shear test capability. A process-integrated quality control (PIQC) system is said to provide wire deformation deformation /de·for·ma·tion/ (de?for-ma´shun)
1. in dysmorphology, a type of structural defect characterized by the abnormal form or position of a body part, caused by a nondisruptive mechanical force.

2.
 graphs for multiple or single wires, data logging (data) data logging - (data acquisition) Storing a series of measurements over time, usually from a sensor that converts a physical quantity such as temperature, pressure, relative humidity, light, resistance, current, power, speed, vibration into a voltage that is then converted  of all error messages DOS and Windows error messages are listed individually in this database by the message that is displayed when they occur. See also DOS error messages and Application Error.

 and tolerance limits, storage and printing of deformation curves for analysis, statistics, and process control.

[ILLUSTRATION OMITTED]

Hesse & Knipps, hesse-knipps.com

Booth 1871
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Title Annotation:Product PREVIEW
Publication:Circuits Assembly
Date:Feb 1, 2007
Words:117
Previous Article:'45 [micro]m accuracy' pick-and-place.(Product PREVIEW)
Next Article:Pre-production process control.(Product PREVIEW)



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