High volume repair system.

For repair challenges arising from component failure, assembly error, device revision and firmware updates, the Fineplacer high volume rework system automatically sequences the repair steps: component (including shield cans) de-solder and discard, residual solder removal and component re-solder. With a placement accuracy of better than 10 microns, the system is suitable for fine pitch, small bump micro-ball grid array (BGA), chip-scale package (CSP) and flip chip demands. It also has a lead-free capable soldering system.

[ILLUSTRATION OMITTED]

Finetech Inc., Phoenix, AZ

Booth 11902

[TEXT NOT REPRODUCIBLE IN ASCII]

Send product releases to Robin Norvell at [e-mail].