Printer Friendly
The Free Library
21,435,892 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

Heller Industries (Florham Park, NJ) and ECD Inc. (Milwaukee, OR) announce that ECD's AutoM.O.L.E.[R] Xpert System can now be shipped as an option with all Heller reflow soldering ovens.

Heller Industries (Florham Park, NJ) and ECD ECD Early Childhood Development
ECD Electron Capture Detector
ECD Energy Citations Database
ECD Executive Creative Director (advertising)
ECD Ethyl Cysteinate Dimer
ECD Electron Capture Dissociation
ECD Electronic Civil Disobedience
 Inc. (Milwaukee, OR) announce that ECD's AutoM.O.L.E.[R] Xpert System can now be shipped as an option with all Heller reflow soldering Reflow soldering is the most common means to attach a surface mounted component to a circuit board, and typically consists of applying solder paste, positioning the devices, and reflowing the solder in a conveyorized oven.  ovens. This strategic partnership enables customers to plan, setup and verify robust target profiles for optimum printed circuit board (PCB PCB: see polychlorinated biphenyl.
PCB
 in full polychlorinated biphenyl

Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound.
) results with Heller ovens. The expanded relationship combines instrumentation, board processing equipment and software to create a self-profiling oven that reduces setup, changeover (programming) changeover - The time when a new system has been tested successfully and replaces the old system.  and production times up to 75 percent--while improving PCB yield rates.
COPYRIGHT 2002 UP Media Group, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2002, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Circuits Assembly
Article Type:Brief Article
Geographic Code:1USA
Date:Mar 1, 2002
Words:86
Previous Article:Lamina Ceramics, Inc (Princeton, NJ), which employs proprietary technology to bond unfired ceramic to metal for use in communications and electronic...
Next Article:SMTA announces Technical Committee.
Topics:



Related Articles
Classic PCB Thermal Profiling of the Reflow Solder Process -- Are you throwing profits away? If you're not profiling your PCB assemblies, you might...
Reflow Oven.
NET gain: the latest the Internet has to offer.
New no-lead solder pastes and reflow techniques: a new study evaluated the performance of SnAgBi and SnAgCu alloys with bare copper and immersion tin...
Component removal and attachment issues: this month, Les clarifies readers' assumptions concerning underfill material in rework and repair and reflow...
Living large: building big, bad backpanels: how are these monsters produced? Phil explains the processes and the equipment.
Beware the jabberwocky: Phil answers some questions that have recently come his way.
Improving the reflow process with SPC: continual data analysis of a reflow process offers increased product quality and reduced manufacturing cost.
The effect of an optimized reflow oven recipe on energy use: better thermal profiling and process optimization tools reduce energy use.
In case you missed it.

Terms of use | Copyright © 2013 Farlex, Inc. | Feedback | For webmasters | Submit articles