Haleos Announces New Sub-Micron Alignment and Bonding Capability for High Volume Electro-Optic Assembly and Manufacturing.
BLACKSBURG, Va.--(BUSINESS WIRE)--Sept. 6, 2001
Haleos, Inc., a leading optical manufacturing services provider, today announced the availability of its new and flux-less sub-micron alignment and bonding capability for high volume electro-optic assembly and manufacturing.
Conventional industry-wide bonders typically produce alignment and bonding specifications of plus or minus five microns. Current generation applications demand precision tolerances for manufacturing and packaging of laser die, VCSEL, and integrating silicon optical bench for transceiver modules.
The Company's precision tolerance serves applications that require sub-micron mounting on silicon substrates, InP, InGaAsP and a mix of other III-V semiconductor materials. By achieving sub-micron tolerances, coupling efficiencies (e.g. laser into fiber) are significantly improved and directly result in increased manufacturability of critical pass/fail devices. In many applications, it eliminates the need for active alignment, and its short cycle time allows for high volume processing.
"For our customers, sub-micron bonding accuracy translates into a vast positive impact," said David Sherrer, Haleos president and chief executive officer. "Access to this technology is vital for developing next generation devices."
Haleos Inc., The New ACT MicroDevices, is a rapidly growing, privately-held fiber optics and photonics optical manufacturing services company headquartered in Blacksburg, Virginia. Haleos is a leading designer, developer and manufacturer of advanced wafer-level microphotonic components, optical interconnects and component integration solutions that enable next generation optical networks. The Company is developing proprietary next generation technologies and integrating them with current products, to significantly change the economics and performance of optical components and systems.