HDPUG Announces Formation of GECI.

The High Density Packaging User Group (HDPUG, Scottsdale, AZ) has announced the formation of the Global Environmental Coordination Initiative (GECI, Scottsdale, AZ), which will work across the electronics industry and around the globe to facilitate introduction of lead-free solder into electronics manufacturing. To maximize knowledge and minimize duplication of work, GECI aims to coordinate the efforts of leading electronics associations and consortia working on lead-free implementation to develop standardized alloys, processes and tools.

"The goal of this initiative is to channel the worldwide resources of electronics organizations and the companies they represent with the common goal of easing industry's transition to lead-free manufacturing," said Ruben Bergman, executive director for HDPUG and chair of the GECI Network. "GECI will develop a global transition plan (roadmap) and share the upfront work needed to facilitate a transition. We will also work to help companies comply with environmental, market and legislative requirements."

The GECI Advisory Board will serve as a steering committee to facilitate agreement on lead-free materials, systems and processes throughout the industry. GECI's mission is to: agree on a voluntary plan for the electronics industry to replace tin-lead solder with a lead-free alloy; agree on one or, at most, two alloys for the majority of applications; identify key standards that should be developed or modified, including design, performance and test standards; and facilitate global cooperation aimed at making the transition as smooth and cost-efficient as possible.

For more information, visit the GECI Website at www.hdpug.org.

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