Global Communication Semiconductors, Inc. Announces the Release of Agilent Technologies' ADS Design Kit for Its InGaP HBT Process.

Business Editors

TORRANCE, Calif.--(BUSINESS WIRE)--June 2, 2003

GCS, Inc. (Global Communication Semiconductors, Inc.), a pure-play III-V compound semiconductor wafer foundry, announced today the release of an InGaP HBT design kit to support Agilent Technologies' Advanced Design Systems (ADS) EDA software. The design kit, developed for GCS's InGaP HBT P2 process, is in response to the strong demand for WLAN (802.11) PA applications.

The InGaP HBT P2 design kit was developed in collaboration between GCS and Agilent Technologies and it provides a complete set of schematics, simulation models, and layout artwork for both active and passive elements. The active device models include both Gummel-Poon and VBIC formats, which provide designers with greater flexibility in design. Measured S-parameter files are also included as part of the design kit. Designers can create layout using a series of fixed artwork and Parameterized Artwork Macros (based on the use of Agilent's Graphical Cell Compiler and Application Extension Language). The implementation of the GCS design kit in the ADS environment allows customers immediate access to the innovative P2 process.

"Our P2 process was developed specifically for WLAN power amplifiers. A foundry design kit is offered as an extension to our foundry services," commented Dr. Owen Wu, Founder & Chief Strategic Officer of GCS. "In the competitive WLAN landscape, time-to-market translates into market share. The idea here is to help our customers achieve first pass design success with minimal design iteration for 802.11 a, b & g applications. In addition to the P2 process, GCS also offers several other qualified InGaP HBT processes (P1 for WCDMA PA, P5 for GSM PA, P6 for infrastructure gain blocks, and D1 for high-speed digital circuits). GCS will continue to roll out the design kits for these processes throughout the remainder of 2003," continued Dr. Wu.

"We are extremely pleased with the results of our collaboration with GCS," said Charles Plott, Marketing Manager, Agilent EEsof EDA. "WLAN is a really competitive market and many of our customers are actively playing in that arena. The availability of a GCS design kit for ADS will give them a broader range of manufacturing options."

Agilent Technologies' Advanced Design System (ADS) offers simulation and layout capabilities for complete front-to-back MMIC design in an integrated design flow. Foundry design kits allow MMIC designers worldwide to use ADS seamlessly with processes used by custom IC manufacturers worldwide.

Global Communication Semiconductors Inc., based in Torrance, California, an ISO 9001-2000 certified company, provides compound semiconductor foundry services to the wireless telecommunication, high-speed networking, aerospace and defense industries. GCS currently offers foundry services for InGaP HBT, InP HBT and PHEMT processes and provides optoelectronic foundry services for QWIP detectors, modulators & PIN diodes used in the surveillance, security and fiber optic communication markets.

For more information on GCS, contact: Wing Yau, Director of Marketing and Applications Engineering, Global Communication Semiconductors, Inc., 23155 Kashiwa Court, Torrance, CA 90505. Tel: [phone], ext. 107. Fax: [phone]. Email: [e-mail]. Web site: http://www.gcsincorp.com.