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Gartner Dataquest Says Worldwide Semiconductor Packaging Equipment Market Decreased 56 Percent in 2001.


Business & Technology Editors

SAN JOSE San Jose, city, United States
San Jose (sănəzā`, săn hōzā`), city (1990 pop. 782,248), seat of Santa Clara co., W central Calif.; founded 1777, inc. 1850.
, Calif.--(BUSINESS WIRE)--April 15, 2002

The worldwide semiconductor packaging equipment market in 2001 suffered the worst contraction in its history, according to according to
prep.
1. As stated or indicated by; on the authority of: according to historians.

2. In keeping with: according to instructions.

3.
 Dataquest Inc., a unit of Gartner, Inc. (NYSE NYSE

See: New York Stock Exchange
: IT and ITB ITB Invitation To Bid
ITB In The Beginning
ITB Internationale Tourismusbörse (German)
ITB In The Business (aka in the business service industry)
ITB Intrathecal Baclofen Therapy
).

Worldwide semiconductor packaging equipment revenue reached $2.98 billion in 2001, a 55.8 decline from 2000 revenue.

"Evidenced by the market downturn, equipment segment performance was down in all categories in 2001," said Jim Walker Jim Walker (né James Donat Walker) (born 1955 in Edmonton) was the original drummer of Public Image Ltd. in 1978.

In 1977 he played drums for Canadian punk band The Furies and moved to London in October 1977.
, principal analyst of Gartner Dataquest's semiconductor research group. "Equipment for wafer-level packaging technologies decreased at a slower rate than the more mature die-level processes. For example, advanced packaging lithography lithography (lĭthŏg`rəfē), type of planographic or surface printing. It is distinguished from letterpress (relief) printing and from intaglio printing (in which the design is cut or etched into the plate).  decreased less than 1 percent, whereas wire bonders decreased over 70 percent. Overall, however, wire bonders continued to be the largest equipment segment for semiconductor packaging, accounting for almost one-fifth of the revenue at 19.4 percent of the total market."

The packaging equipment market remained highly distributed, as the leading vendors, Kulicke & Soffa and Tokyo Seimitsu, each accounted for just 6 percent of the total market (see Table 1). All of the top-tier vendors A vendor of a product that is highly recognized for its brand name. Examples of top-tier hardware vendors are HP, IBM and Apple.  experienced a decline in revenue in 2001.

Table 1
Top 10 Worldwide Semiconductor Packaging/Assembly Vendors in 2001
(Millions of U.S. Dollars)
----------------------------------------------------------------------
                        2001     2001      2000     2000    2001-2000
                     Revenue    Market   Revenue   Market   Growth (%)
Company                        Share (%)          Share (%)
----------------------------------------------------------------------
Kulicke & Soffa         179       6.0       610       9.0     -70.7
Tokyo Seimitsu          178       6.0       450       6.7     -60.5
ASM Pacific             135       4.5       426       6.3     -68.3
Advantest               127       4.2       275       4.1     -54.0
Tokyo Electron          113       3.8       264       3.9     -57.3
Shinkawa                105       3.5       357       5.3     -70.7
BE Semiconductor, Fico   98       3.3       139       2.1     -29.5
ESEC                     93       3.1       357       5.3     -73.9
Delta Design             80       2.7        NA         -         -
Dai-Ichi Seiko           78       2.6       210       3.1     -62.7
Others                1,796      60.2     3,662      54.3     -51.0
Total Market          2,981     100.0     6,749     100.0     -55.8
----------------------------------------------------------------------
Note: Columns may not add to totals because of rounding.
Source: Gartner Dataquest (April 2002)


"We believe that growth will return the second half of 2002, but not enough to bring about a positive growth rate for the year," said Walker. "However, as array packaging continues to grow, and its derivatives of flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done , wafer level and chip-scale packaging become more predominant, changes will be evident in 2003. This will become evident as the demand for flip chip bonders, wafer bumping equipment and solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i.  deposition increase."

This year, Gartner Dataquest market share results were based on using SAB 101 revenue in accordance with changes in accounting policy mandated by the Securities and Exchange Commission. These changes primarily affect companies publicly traded on U.S. stock exchanges, but SAB 101 policies have been adopted by a few other companies as well.

Gartner Dataquest has released a series of Alerts providing 2001 market share results for the semiconductor equipment and manufacturing industry. Additional information is available in the Alert "Semiconductor Packaging Equipment Market Decreases by 56 Percent in 2001." There are additional Alerts titled "Wafer Fab Equipment market Declines 29.8 Percent in 2001" and "Semiconductor Manufacturing Equipment Sales Contract Sales Contract

Contract between a seller and buyer for the sale of goods, services, or both.
 34 Percent in 2001" that examine the top-tier vendors in the semiconductor equipment and packaging industries.

This research is produced by Gartner Dataquest's Semiconductors Worldwide group. This research group combines memory, microcomponents, logic, ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. , analog, discrete device A discrete device (or discrete component) is an electronic component with just one circuit element, either passive (resistor, capacitor, inductor, diode) or active (transistor or vacuum tube), other than an integrated circuit. , RF and optical segments into a complete industry picture. Products, suppliers, startups, technologies, regional consumption, applications and emerging technologies are all covered in this broad program. More information about information can be found in the Gartner Semiconductor Focus Area at http://www.gartner.com/1_researchanalysis/focus/semimkt_fa.html. To subscribe to Verb 1. subscribe to - receive or obtain regularly; "We take the Times every day"
subscribe, take

buy, purchase - obtain by purchase; acquire by means of a financial transaction; "The family purchased a new car"; "The conglomerate acquired a new company";
 this service, please call 408-468-8000. Reports can be purchased on the Internet at www.gartner.com.

Gartner Dataquest is the recognized leader in providing the high-technology and financial communities with market intelligence for the semiconductor, computer systems and peripherals, communications, document management, software, and services sectors of the global information technology industry.

Gartner, Inc. is a research and advisory firm that helps more than 11,000 clients understand technology and drive business growth. Gartner's divisions consist of Gartner Research, Gartner Consulting, Gartner Measurement and Gartner Events. Founded in 1979, Gartner, Inc. is headquartered in Stamford, Connecticut Stamford is a city in Fairfield County, Connecticut, United States. According to 2006 Census Bureau estimates, the population of the city is 119,261, making it the fourth largest city in the state. , and consists of 4,300 associates, including 1,200 research analysts and consultants in more than 90 locations worldwide. The company achieved fiscal 2001 revenue of $952 million. For more information, visit www.gartner.com.
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Date:Apr 15, 2002
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