GaSonics Introduces New Plasma Source for Its PEP Line of Integrated Clean Systems.

SAN JOSE, Calif.--(BUSINESS WIRE)--July 7, 1998--GaSonics International (NASDAQ/NM:GSNX), a leading supplier of integrated clean solutions, today announced the introduction of the Stinger(tm) source -- a new plasma source for GaSonics' line of Performance Enhancement Platform (PEP) systems. Utilizing the same microwave source technology featured in GaSonics' Millennia(tm) 300 mm integrated clean system, the Stinger offers chipmakers lower cost of ownership, higher removal rates and higher throughput for 200 mm photoresist, residue removal and isotropic etch applications.

Commenting on the significance of the new plasma source, GaSonics' President and Chief Executive Officer Asuri Raghavan noted, "With the Stinger source, we are bringing our best-of-breed 300 mm source technology to our popular PEP line of 200 mm integrated clean systems. This technology, which combines the advantages of our 200 mm photoresist and residue removal source technologies into a single, more powerful plasma source, will become the universal source for all PEP applications." Raghavan added, "Since customers will now be able to develop their 300 mm integrated clean processes on our 200 mm hardware, it enables an easy transition to 300 mm processes."

At the core of the Stinger source is a proprietary power applicator developed in cooperation with Oakridge National Labs. The applicator, which is currently used in GaSonics' production-proven PEP photoresist removal system, is used in conjunction with a tuned cavity to deliver microwave power uniformly over a larger area of the plasma chamber. As a result, more energy is available for active species generation than prior-generation hardware, thus improving efficiency by more than 20 percent and enabling higher removal rates. In addition, the source is capable of delivering 3 kW of power to generate much higher removal rates or maintain the same rates at lower temperature, which is critical for temperature-sensitive process steps involving copper, low k dielectrics or implanted resist.

GaSonics' Director of Product Management Ken Drachnik noted, "The Stinger source is a key enabler in allowing our customers to operate efficiently over a wide range of process chemistries and conditions used in advanced clean applications. Even on current applications, customers immediately realize the source's process and cost-of-ownership advantages. For instance, because the source can utilize sapphire components, it is ideal for fluorine-containing chemistries required for clean applications."

The Stinger's core technology has already been qualified for 0.18 micron. It is also proven for 300 mm applications, resulting in a 5 micron/minute removal rate of DUV resists with less than or equal to 5 percent within wafer uniformity.

The new source will be available on all new PEP systems. GaSonics plans to introduce new solutions for the following applications in the next six to nine months: post-via etch residue removal; post-implant resist and residue removal; post-polysilicon etch residue removal; post-metal etch residue removal; and isotropic etch.

GaSonics International (Nasdaq NM:GSNX) is a leading global supplier of integrated clean solutions. GaSonics' photoresist and residue removal tools improve device performance and increase yield in semiconductor manufacturing. GaSonics' technology leadership also includes vertical high-pressure (VHP) thermal processing for ultrathin gate oxides and low-pressure chemical vapor deposition (LPCVD) for liquid-crystal display (LCD) manufacturing. Headquartered in San Jose, Calif., GaSonics supports its installed base of more than 4,500 systems through a global sales and support network. Additional information about the company is available on GaSonics' website, located at http://www.gasonics.com

    CONTACT: GaSonics International
              Andy Kirkpatrick, 408/570-7193
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