Fujitsu develops room temperature embedding process.TOKYO -- Fujitsu Limited, Fujitsu Laboratories Ltd. and the National Institute of Advanced Industrial Science and Technology The National Institute of Advanced Industrial Science and Technology (産業技術総合研究所 of Japan have developed what they claim is the world's first technologies for enabling formation and multilayering at room temperature of ceramic film with dielectric constant dielectric constant n. See permittivity. of 400 on resin circuit boards. The new technologies are said to enable the embedding of passive components into PCBs. By utilizing ceramic particles that feature chemically unstable surface characteristics, a ceramic film was successfully created at room temperature on resin circuit boards, which do not usually adhere to ceramic. Fujitsu said in a release that the new ceramic film's maximum Dk of 400 is approximately the same as that of film made with the sputtering A popular method for adhering thin films onto a substrate. Sputtering is done by bombarding a target material with a charged gas (typically argon) which releases atoms in the target that coats the nearby substrate. It all takes place inside a magnetron vacuum chamber under low pressure. method using 600[degrees] heat-treating. A condenser condenser Device for reducing a gas or vapour to a liquid. Condensers are used in power plants to condense exhaust steam from turbines and in refrigeration plants to condense refrigerant vapours, such as ammonia and Freons. composed of three layers was also successfully created on an FR-4 PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. . The capacitance density of the newly created condenser achieved 300 nF/[cm.sup.2]. |
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