Fujitsu's Flip Chip Plastic BGA Package with Buildup Substrate Technology Designed to Meet ASIC Computing and Communication System Demand; To be Shown at Surface Mount International Conference, Booth 82-3.

SAN JOSE, Calif.--(BUSINESS WIRE)--Sept, 8, 1997--Fujitsu Microelectronics, Inc., (FMI) today introduced the industry's leading Flip Chip Plastic Ball Grid Array (FC-PBGA) packaging capabilities, featuring enhanced electrical, thermal, and mechanical properties for computing and communications applications.

Developed to meet the fast-growing demand for flip chip technology, the new Flip Chip BGA meets high speed application requirements at Gigahertz frequencies and provides I/O counts ranging from 500 to more than 1000 pinouts. Fujitsu's buildup substrate technology at 100 micron line pitch and 50 micron space/width provides the FC-BGA with superior electrical performance, including reduced inductance and dielectrics, compared with standard molded BGAs. Fujitsu also offers thermal management CTE matching options with their optimized designs for heat spreaders, thermal compounds, heatsinks, and thermal vias for maximum power dissipation requirements.

"Fujitsu has developed a thin profile flip chip BGA with optimal electrical and thermal properties that makes the package a superior choice for high-performance ASIC and processor computing applications," said Ajay Mody, Director of FMI's Advanced Packaging Technology Group. "Flip chip packaging is already popular in consumer applications, and is now emerging in computer and communications system designs. It eliminates the restrictions imposed by wire bonding technology, and I would expect rapid growth in all mid-range to high end BGA applications through the year 2000."

Mody added that because Fujitsu uses it own wafer bumping services and provides all manufacturing, assembly, and test facilities, the company's Advanced Packaging Technology Group can offer a one-stop, turnkey solution for customers who use FC-BGA packaging.

Samples of the new FC-BGA will be available in October with a four-week delivery time. Pricing depends on specific customer requirements. For more information contact Michelle Hou at Fujitsu Advanced Package Technology at 408/922-9530 or [e-mail] .

Fujitsu Microelectronics, Inc. (FMI) designs, manufactures and markets a comprehensive portfolio of advanced semiconductor products. FMI provides customers with sophisticated design capabilities and access to one of the industry's largest, most experienced research and development teams with worldwide manufacturing facilities. Based in San Jose, Calif., FMI is a leading supplier of high-performance ASICs, memory devices, RISC embedded processors, multi-chip module and multi-chip package products, SPARC processors for workstation applications, high-speed I/O devices, ATM ICs, and Ethernet LAN ICs. The company also is developing advanced 3D graphics devices. For more information about FMI's products and technologies, visit the company web site at www.fujitsumicro.com .

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Dick Davies, 415/777-4161