Frost & Sullivan Recognizes Amkor Technology for Advanced Semiconductor Packaging and Test Technologies.MOUNTAIN VIEW, Calif. -- Based on its recent analysis of the advanced electronic packaging market, Frost & Sullivan recognizes Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, , Inc. with the 2009 Global Frost & Sullivan Technology Innovation of the Year Award for its line-up of innovative new products, including through mold via package on package (TMV Noun 1. TMV - the widely studied plant virus that causes tobacco mosaic; it was the first virus discovered (1892) tobacco mosaic virus plant virus - a plant pathogen that is a virus consisting of a single strand of RNA [TM] PoP), FusionQuad[R], and flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done molded ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (FC(M)BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. ). Amkor delivers tailored, application-specific package design, as well as assembly and test solutions, and is a leading source for many of its customers' integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for (IC) packaging assembly and test requirements. FusionQuad[R] represents a breakthrough in lead frame-based plastic packaging, which provides a cost-effective platform for increased lead counts in a standard QFP (Quad FlatPack) A square, surface mount chip package that has leads on all four sides and comes in several varieties. PQFP (Plastic QFP) may refer to all of the following QFP types. All quad flatpacks use gull-wing leads, except for the CQFP, which stick straight out. form factor. FusionQuad[R] provides excellent electrical and thermal performance along with a reduction in packaging size. FusionQuad[R] applications include a wide range of devices such as hard disk drives, laptop PCs, Ethernet communication, digital television, and data conversion. It offers outstanding performance in a high-density, cost-effective, lead frame plastic package. "FC(M)BGA is the advanced and improved version of Amkor's Super Flip Chip (SuperFC[R]) high performance platform," says Frost & Sullivan Research Analyst, Karthik Kamalakannan. "This technology provides multiple benefits, including improved board space usage, by allowing closer spacing between passive components and the flip chip die resulting in smaller body size and cost savings." Other benefits of FC(M)BGA are reduced warpage, enabling use of thin core substrates, and improved solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. joint reliability. This packaging technology's flexibility makes it a reliable solution in applications that require robust and cost-effective high pin count flip chip packaging in harsh thermal applications. FC(M)BGA is targeted for use in networking and storage, gaming, broadband communications, computer, multimedia, and many other applications. TMV[TM] PoP, Amkor's latest offering, is a novel product for next generation package on package applications. It is designed to address challenging 3D architecture requirements in handheld multimedia products enabling higher signal processing See DSP. and memory densities. TMV[TM] PoP provides superior interconnect and form factor benefits to IC and system designers alike. "TMV[TM] PoP allows for thinner bottom packages that offer a larger die-to-package ratio, and has shown significant improvement in warpage control with up to a 30 percent increase in die-to-package size," notes Karthik. "TMV[TM] also removes the solder ball In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. pitch versus stack height limitations seen in current PoP technologies and will allow the stacked interface to scale down to 0.3mm pitch supporting high density roadmap requirements." Amkor has built a reputation for introducing innovative IC packaging technologies to the semiconductor industry, proving its long-term commitment to R&D. As the time-to-market demand is increasing across semiconductor applications, the company has applied a cross-functional co-development approach to new packaging development that integrates R&D, factory, business development, and product management experts. Each year, Frost & Sullivan presents this award to the company (or individual) that has carried out new research, which has resulted in innovation(s) that have or are expected to bring significant contributions to the industry in terms of adoption, change, and competitive posture. This award recognizes the quality and depth of a company's research and development programs as well as the vision and risk-taking that enabled it to undertake three major new package platform launches in the past year. Frost & Sullivan's Best Practices Awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants The term market participant is used in United States constitutional law to describe a U.S. State which is acting as a producer or supplier of a marketable good or service. When a state is acting in such a role, it may permissibly discriminate against non-residents. and measure performance through in-depth interviews, analysis, and extensive secondary research in order to identify best practices in the industry. About Amkor Technology, Inc. Amkor Technology, Inc. (Nasdaq: AMKR AMKR Amkor Technology ) is a leading provider of semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings. Additional technical information on the above referenced packages can be found on: www.amkor.com. About Frost & Sullivan Frost & Sullivan, the Growth Partnership Company, enables clients to accelerate growth and achieve best in class positions in growth, innovation and leadership. The company's Growth Partnership Service provides the CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. and the CEO's Growth Team with disciplined research and best practice models to drive the generation, evaluation, and implementation of powerful growth strategies. Frost & Sullivan leverages over 45 years of experience in partnering with Global 1000 companies, emerging businesses and the investment community from more than 35 offices on six continents Six Continents is a large retail PLC in UK which split into Six Continents Retail known as Mitchells and Butlers plc. The hotels and soft drinks business of Six Continents PLC is now known as InterContinental Hotels Group PLC. . To join our Growth Partnership, please visit http://www.frost.com. |
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