Frequency Technology's Columbus Key to SandCraft Deep Submicron Design; SandCraft Presents Advanced Methodology at DesignCon99.

SANTA CLARA, Calif.--(BUSINESS WIRE)--Feb. 2, 1999--SandCraft, Inc. presented a paper today at DesignCon99 detailing the advanced design methodology utilized for the implementation of their high-performance embedded MIPS(TM) processor, the SR1. The paper -- titled "Novel Design Techniques for the Design of an Embedded Microprocessor Core" -- was delivered by Simon Butler, member of the technical staff at SandCraft, Inc.

Mr. Butler explained how performance and cost objectives were the primary factors driving the design team to adopt a custom design style for the development of their processor. The engineering team assembled a design flow that combined best-in-class tools for all steps.

"Special emphasis was placed on accurate interconnect modeling because the design team recognizes the importance of this design flow step in achieving optimal chip performance," stated Simon Butler. "With the advanced deep sub-micron process technology targeted by SandCraft, it is an accepted fact that the interconnect dominates the performance of the overall chip."

The methodology started with Mentor Graphics' xCalibre(TM) for a simple capacitor extraction. When the best accuracy was necessary, Frequency Technology's Columbus interconnect modeler was invoked which produces distributed RC models for the most critical nets. The accuracy of the tools was calibrated with the QuickCap(TM) field solver before this strategy was implemented. Columbus consistently demonstrated extraction accuracy within 2% of the field solver with 5% maximum error. xCalibre results were within 10% of the field solver. The higher accuracy of Columbus was key to help the SandCraft engineers meet their tight timing budgets.

This innovative methodology is being used for the development of SandCraft's next generation SR1 processor. This new core is initially targeted for a 0.18um process and will run at speeds of 350MHz and above.

SandCraft, Inc. is a developer of advanced microprocessor technologies for high-performance electronic systems, which are licensed to semiconductor manufacturers and other electronics firms as complete, verified-functionality chip designs. Founded in June 1996, the company applies its expertise in CAD tool development, semiconductor design and implementation, and technology integration to create and deliver microprocessor and system-on-a-chip solutions.

More information about SandCraft, Inc. may be obtained at http://www.sandcraft.com, or from the following contacts: Matthew Schmidt, FS Communications: 650/691-1488 or matt@fscomm; Dirk Smits: 408/490-3247 or [e-mail].

Frequency Technology, Inc., based in San Jose, California, was founded in 1995 to focus exclusively on developing solutions that improve the performance of sub-quarter micron designs. Frequency's tools enable designers to accurately predict the performance of the interconnect. In 1997, the company launched Columbus(R) True-3D(TM) interconnect modeler, the only technology which accurately models the interconnect in deep sub-micron designs, and the first of its complete family of electronic design automation tools based on True-3D Technology. Frequency created the SIPPs standard for interconnect performance which is now sponsored by Si2. The company has raised venture funding from IVP, Sigma Partners, Menlo Ventures, Atlas Venture, Sofinnova and Skywood Ventures.

The company is located at 100 Park Center Plaza, Suite 365, San Jose, CA 95113. Phone: [phone]. Fax: [phone]. URL:www.frequency.com.

Note to Editors: Frequency is a Cadence Design Systems (NYSE:CDN) Connections partner and a member of Mentor Graphics' (Nasdaq:MENT) Open Door program. Columbus is a registered trademark of Frequency Technology, Inc. MIPS is a trademark of MIPS Technologies, Inc.