Freescale Ships 10 Millionth High-Power, High-Frequency Plastic-Packaged RF Transistor.

AUSTIN, Texas -- Leader in RF power transistors for wireless infrastructure drives plastic packaging as a cost-effective alternative to metal-ceramic technology

Freescale Semiconductor (NYSE: FSL)(NYSE: FSL.B), the leading supplier of high-power radio frequency (RF) power transistors for 2.5G and 3G wireless base station amplifiers, achieved a milestone unparalleled in the industry: shipment of more than 10 million high-power, high-frequency RF power transistors in plastic packages.

Freescale's advanced TO Series RF power plastic packaging provides an economical, reliable and robust alternative to conventional metal-ceramic packaging for cost-sensitive RF applications, such as cellular base station amplifiers supporting GSM, EDGE, CDMA and W-CDMA technologies. Freescale offers the industry's broadest portfolio of RF power plastic packages, with 10 package outlines to choose from. The plastic packages are designed specifically for high-power RF applications and to deliver output power as high as 130 watts and frequencies above 2 GHz.

"Freescale not only pioneered the development of high-power RF packaging to meet the demanding requirements of power amplifier manufacturers, but we continue to set the pace in plastic package performance, temperature ratings, reliability and volume production," said Gavin Woods, vice president and general manager of Freescale's RF Division. "Shipping more than 10 million RF power plastic devices underscores the broad market acceptance of Freescale's plastic packaging technology. We are one of the few silicon suppliers to offer RF transistor capabilities in plastic that are comparable to metal-ceramic."

Freescale's heritage of plastic packaging leadership spans more than 30 years. In the mid-1980s the company pioneered low-frequency, high-power plastic packaging for the automotive and industrial industries. Leveraging its innovative, high-performance plastic technology, in 1997 Freescale delivered the industry's first high-power, high-frequency RF devices in plastic packages optimized for wireless infrastructure applications. In 2003, Freescale introduced the first 2-GHz RF power plastic devices with a maximum junction temperature rating of 200 degrees Celsius, which for the first time matched the junction temperature capability of traditional RF transistors in metal-ceramic packages.

In developing its high-power plastic package technology, Freescale applied the same rigorous quality, reliability and industry-standard testing practices used for low-frequency power plastic packaging in under-the-hood automotive applications. Freescale has added features to make its plastic packages comparable to metal-ceramic packaging in terms of frequency, thermal performance, maximum junction temperature, standards compliance and reliability.

Freescale's RF power transistors in plastic packaging offer numerous benefits to power amplifier manufacturers:

--  Cost savings over ceramic packaging, enabling lower system cost
--  Exceptional performance with 200 degrees Celsius maximum junction
    temperature
--  Multiple mounting options compatible with traditional high-power
    RF applications, as well as surface mount modes for customer ease
    of use
--  Tight mechanical tolerances (less than 50 microns, a more than 50
    percent improvement over traditional ceramic packaging )
--  Copper heat sink for excellent thermal resistance
--  Packages registered with JEDEC, the leading developer of standards
    for the solid-state industry
--  Lead-free processing compatibility, with moisture sensitivity
    level (MSL) rating of 3 or better at 260 degrees Celsius reflow
    soldering
--  Environmentally designed for restriction of hazardous substances
    (RoHS) compliance
--  Automated assembly manufacturing line for lower completed
    package cost

For more information about Freescale's RF power transistor portfolio, RF LDMOS technology and plastic and metal-ceramic packaging options, visit www.freescale.com/rf.

About Freescale Semiconductor

Freescale Semiconductor, Inc. (NYSE: FSL, FSL.B) is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. Freescale became a publicly traded company in July 2004 after more than 50 years as part of Motorola, Inc. The company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale, a member of the S&P 500(R), is one of the world's largest semiconductor companies, with 2004 sales of $5.7 billion (US).

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