FormFactor's Newest Probe Card Delivers High Throughput 300 mm DRAM and Flash Memory Wafer Test.

SAN JOSE, Calif. -- FormFactor Four Touchdown Probe Card Enables Reliable High-Throughput Wafer Test, Lower Total Cost of Test for 300 mm Memory Manufacturers

FormFactor, Inc. (Nasdaq:FORM), a leading provider of advanced wafer probe cards, today announced a new high parallelism probe card, which tests 300 mm DRAM or Flash memory wafers in as few as four touchdowns. The new FormFactor PH150S(TM) wafer probe card leverages FormFactor's proprietary technologies, including its MicroSpring(R) contact and design technologies and its precision micro machining manufacturing processes, to cost-effectively expand wafer test capacity and reduce total cost of test.

Typical 300 mm memory wafers contain more than 2X the number of die found on a 200 mm wafer, creating the need for a substantial increase in wafer test capacity. 512Mbit DRAM devices and 4 Gbit Flash devices enabled by technology shrinks are also generating longer test times and even greater test capacity needs. FormFactor's new four-touchdown PH150S for 300 mm wafer test addresses the test issues and expands test capacity of capital equipment by enabling higher test throughput, producing a lower total cost of test for memory manufacturers.

The PH150S is FormFactor's first wafer probe card to extend the superior probe performance of its MicroSpring interconnect technology to a four-touchdown 300 mm wafer test solution. FormFactor's wafer probe cards use a blend of proprietary technologies to achieve superior contact reliability, signal integrity and low voltage performance, delivering increased yields when testing advanced memory devices. In field trials, FormFactor's wafer probe technology has been proven to reduce test cell downtime and increase yields for a variety of memory devices.

"Our new four-touchdown PH150S probe card is the latest example of how FormFactor's technologies and product roadmap continuously scale to address our customers' needs," said Amy Leong, product line manager for FormFactor. "Maintaining a low cost of test is critical for our DRAM and Flash manufacturing customers moving to 300 mm wafer production. With our MicroSpring technology, we have expanded the available probe area to achieve the next step in highly parallel wafer test, helping memory manufacturers increase their return on investment in 300 mm wafer manufacturing capacity."

FormFactor continuously develops new probing technologies to enable the semiconductor industry keep pace with trends in DRAM and flash manufacturing. FormFactor's products and technologies help semiconductor manufacturers optimize their semiconductor pipelines for lower cost and higher performance when building new fabs, expanding capacity, transitioning to more advanced processes, introducing newly designed products or implementing die size reductions.

Availability

FormFactor's PH150S 300 mm four-touchdown wafer probe card will be available for order in Q4 2004. Please contact FormFactor for pricing and lead time information.

About FormFactor

FormFactor, Inc. (Nasdaq:FORM) is an industry leader in the design, development, manufacture, sale and support of precision, high-performance advanced semiconductor wafer probe cards. The company's products are based on its proprietary technologies, including its MicroSpring interconnect technology and proprietary design processes, which enable FormFactor to produce wafer probe cards for test applications that require reliability, speed, precision and signal integrity. FormFactor is headquartered in Livermore, California. For more information, visit the company's web site at www.formfactor.com.

FormFactor and MicroSpring are registered trademarks of FormFactor, Inc.

Forward-Looking Statement 

Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward-looking statement due to various factors, including, but not limited to: the specific test requirements of semiconductor manufacturers, and the performance and market acceptance of FormFactor's new products or technologies. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in FormFactor's report on Form 10-Q for the fiscal period ended March 27, 2004, filed with the Securities and Exchange Commission ("SEC"), and subsequent filings. Copies of filings made by FormFactor with the SEC are available at http://investors.formfactor.com/edgar.cfm. FormFactor assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in forward-looking statements.