For Embedded Applications and Battery Operation; New Advanced Single Chip Modem with Integrated Silicon DAA Driver from TDK Semiconductor.Business Editors and High-Tech Writers TUSTIN, Calif.--(BUSINESS WIRE)--Nov. 27, 2000 TDK TDK Türk Dil Kurumu (Turkish Language Council) TDK The Dark Knights (gaming clan) TDK Tokyo Denkikagaku Kogyo KK (TDK Electronics Co. Ltd. Semiconductor, a leader in the design and manufacture of communication semiconductors for worldwide markets, has introduced an advanced single-chip modem that combines all the controller (DTE (Data Terminating Equipment) A communications device that is the source or destination of signals on a network. It is typically a terminal or computer. Contrast with DCE. DTE - Data Terminal Equipment ) and data pump functions necessary to implement an intelligent V.22bis data modem. This device, designated the 73M2909, is based on the company's implementation of the industry standard 8032 microcontroller core with a proprietary multiply accumulate (MAC) coprocessor; Sigma-Delta A/D A/D See advance-decline line (A/D). and D/A converters; and an analog front end with integrated silicon DAA DAA - Distributed Application Architecture: under design by Hewlett-Packard and Sun. A distributed object management environment that will allow applications to be developed independent of operating system, network or windowing system. interface. All ROM and RAM necessary to operate the modem are contained on the device. The 73M2909 is a high performance, low voltage, low power, single chip modem capable of data transmission and reception through 2400bps. The 73M2909 is intended for embedded applications and battery operation. This device offers options for modem design ranging from a 3.3 volt low power design to a conventional 5 volt design with optional internal hybrid and fully programmable country call progress support, including CTR-21. According to Bill Boldt, vice president of TDK Semiconductor's Embedded Systems business unit: "This is the third in our family of true 'one chip' modem solutions for embedded systems. This follows the introduction of the first `all-in-one' chip (73M2901) in 1999, followed by the release in May 2000 of our second chip (73M2902), both ideal for the set-top box market as well as many other applications. "This family of products is backed by over 20 years of TDK Semiconductor's modem design experience and customer support. This powerful new 73M 2909 modem IC is flexible, feature rich, and easy to design-in. It offers many user friendly features such as country-specific call progress support, including CTR-21, which makes it ideal for European usage." The 73M2909 is available in 32 pin PLCC (Plastic Leaded Chip Carrier) A plastic, square, surface mount chip package that contains leads on all four sides. The leads (pins) extend down and back under and into tiny indentations in the housing. See chip package. and 44 pin TQFP See QFP. packaging. Sample units and evaluation boards are available, with production planned for February 2001. Pricing for the 73M2909 is $9.89 in 25,000 unit quantities. Additional product information and the name of the closest representative can be obtained by visiting the company's Web site at http://www.tdksemiconductor.com or by calling 714/508-8800. TDK Semiconductor, part of the $6.3 billion TDK Corp. (NYSE NYSE See: New York Stock Exchange :TDK), is a leader in advanced technology IC solutions for communications markets. The company designs and manufactures semiconductor solutions for embedded systems, LAN/WAN LAN/WAN Local Area Network/Wide Area Network and set-top box applications. Its products are used globally for connectivity and data acquisition. |
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