Flip chip soldering fluxes.PK-001 and PK-002 flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done epoxy fluxes are designed for use with Sn62 and Sn63 eutectic solders. The fast curing, halide-free, no-clean fluxes can be used for flip chip or chip-scale package (CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P ) soldering processes. The fluxes have a stable thermoset A polymer-based liquid or powder that becomes solid when heated, placed under pressure, treated with a chemical or via radiation. The curing process creates a chemical bond that, unlike a thermoplastic, prevents the material from being remelted. See thermoplastic. residue and are compatible with standard underfill materials, conformal coatings and most finishes and coatings. They are also environmentally friendly. Many effective methods can be used to apply the fluxes, such as pin transfer, stencil stencil, cutout device of oiled or shellacked tough and resistant paper, thin metal, or other material used in applying paint, dye, or ink to reproduce its design or lettering upon a surface. printing, dispensing or dipping techniques. Indium Corp., Utica, NY www.indium.com |
|
||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion