Flip chip bonder.

The 8800 FC Quantum enables high throughput in a single machine for a variety of flip chip applications. The machine's dual bonding system (DBS) consists of two flip modules, two gantries--each fitted with a bond head and substrate camera, two slide fluxers and two upward-looking cameras. It achieves up to 10,000 UPH (dry cycle) and maintains constant, secure process times and 10[micro]m at 3-sigma placement accuracy.

Datacon North America Inc., Trevose, PA

Booth 10930

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