Flip chip adhesive and epoxy products.Creative Materials, Inc., has introduced two materials designed for flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done assembly. GPC-251A/B A/B Airborne A/B Afterburner (jet engines) A/B Air Blast A/B Answerback A/B Auto-brake A/B Air Bus A/B Afterburning is a silver fitted, electrically conductive, two-part room-temperature curing adhesive used to connect the bumps on the underside of circuit boards. 123-38A/B-187 is a thermally conductive underfill epoxy epoxy Any of a class of thermosetting polymers, polyethers built up from monomers with an ether group that takes the form of a three-membered epoxide ring. The familiar two-part epoxy adhesives consist of a resin with epoxide rings at the ends of its molecules and a curing that strengthens the chip package and protects it from moisture. It is designed to release entrapped air rapidly during cure to produce a smooth, pinhole-free surface. Flip chip technology is a process that has long been used in the automotive industry The automotive industry is the industry involved in the design, development, manufacture, marketing, and sale of motor vehicles. In 2006, more than 69 million motor vehicles, including cars and commercial vehicles were produced worldwide. and now is growing in popularity among makers of cell phones, handheld electronics, and microprocessors. For additional product information, contact: 978.649.4700 or inquiry@creativematerials.com. |
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