Flip Chip Bonder.The Model 850 flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done bonder is designed for flip chips, chip-scale devices and bare die See bare chip. used in entry level, low-volume production and development project environments requiring accuracies of plus/minus 12 micron. The bonder may be equipped with a Model 870 attachment for reworking flip chips that have been bonded using new reworkable underfill materials to avoid scrapping boards. Semiconductor Equipment Corp., Moorpark, CA Hall B6, Booth 225 Circle 119 http://www.circuitsassembly.com/ Copyright [copyright] 2001 CMP CMP (cytidine monophosphate): see cytosine. (1) (CMP Media LLC, Manhasset, NY, www.cmp.com) Part of United Business Media, CMP is a leading integrated media company that offers a wide variety of publications and services in the information Media LLC (Logical Link Control) See "LANs" under data link protocol. LLC - Logical Link Control |
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