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Flip Chip 2001 Conference; IMAPS Europe Announced.


With the flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done  technology market expected to hit 2.5 billion die in 2002, The International Microelectronics And Packaging Society (IMAPS IMAPS IMAP (Internet Message Access Protocol) Secure
IMAPS International Microelectronics And Packaging Society
IMAPS Interstellar Medium Absorption Profile Spectrograph
IMAPS Integrated Military Airlift Planning System (MAC) 
, Washington, D.C.) is sponsoring Flip Chip 2001, a conference and exhibition on flip chip technology, June 18 and 19, 2001, at the Four Seasons Hotel in Austin, TX. Flip Chip 2001 is an outgrowth of the IMAPS Flip Chip Advanced Technology Workshop held previously at the Chateau Elan Chateau Elan is the largest winery in Georgia[1] and is located in Braselton, 40 miles (0 km) north of Atlanta.

It was founded in 1982 by Dr. Don Panoz who came from the pharmaceutical industry.
 Winery win·er·y  
n. pl. win·er·ies
An establishment at which wine is made.

Noun 1. winery - distillery where wine is made
wine maker
 and Resort in Braselton, GA.

An aggressive growth rate of 28.5 percent per year is expected for the flip chip market in 2002. With the growth of the flip chip industry, the technical program will continue to focus on recent advances in flip chip technology as well implementation issues In the Business world, companies frequently set-up a connection between which they transfer data. When the connection is being set-up, it is referred to as implementation. When issues occur during this phase, they are known as implementation issues. . In addition, the local chapter will host a tabletop exhibition that will be included with the workshop to allow attendees to see the latest products and services available. The national organization will hold a focused exhibition for suppliers who support the use of flip chip technology.
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Title Annotation:The International Microelectronics And Packaging Society
Publication:Circuits Assembly
Article Type:Brief Article
Geographic Code:1USA
Date:Mar 1, 2001
Words:168
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