Fairchild's New 8-Terminal Logic Package -- MicroPak-TM- 8 -- is 60% Smaller Than US8.

Business Editors/High-Tech Writers

SOUTH PORTLAND, Maine--(BUSINESS WIRE)--June 18, 2003

MicroPak 8's Rugged Attachment System Improves Yields And Reliability

Over a Wide Range of Mechanical and Temperature Stresses

Fairchild Semiconductor International (NYSE:FCS) introduces MicroPak 8, a new eight-terminal chip scale leadless package for 1-, 2- and 3-bit logic and switch functions.

The new TinyLogic(R) MicroPak 8 package offers 60% space savings over leaded US8 packages while maintaining 0.5mm terminal pitch. This allows designers to take advantage of the dramatic size reduction to incorporate product improvements or to implement new designs while utilizing existing component mounting processes. Fairchild MicroPak 8 devices are ideal for use in PDAs, cell phones, digital cameras, notebooks and other ultra portable applications.

The large, 0.2 x 0.3mm land grid array (LGA) contact pads assure strong joint integrity essential for reliable operation under harsh environmental stresses such as excessive keyboard pressure and over-temperature conditions. Offered now in MicroPak 8 is the UHS high-performance low-voltage logic family that includes triple buffers, dual 3-state buffers, dual gates, flip flops, dual analog and bus switches. Later this year, new high-performance 1, 2- and 3-bit Ultra Low Power (ULP) and ULP-A logic functions, designed for 0.9 to 3.3V operation, will be offered in MicroPak 8.

"MicroPak's encapsulated chip-on-substrate approach provides relatively large mounting terminals that support high insertion yields and allow rapid implementation and swifter adoption into the new generation of portable products," said Ken Murphy, Fairchild product launch manager for logic products. "By using LGA technology with large area terminal pads on the substrate, MicroPak packaging provides a rugged attachment to the PC board, making it extremely reliable over a wide range of mechanical and temperature stresses."

The introduction of MicroPak packages further expands Fairchild's innovative package offering that includes MOSFET BGA and FLMP packaging.

Price (each; 10K volume):

   $0.27 -- MicroPak 8 packaged UHS Dual Buffer with 3-STATE Output
            (NC7WZ125L8X)

   $0.27 -- MicroPak 8 packaged UHS Dual 2-Input AND gate (NC7WZ08L8X)

   $0.27 -- MicroPak 8 Packaged UHS Dual 2-Input NOR gate (NC7WZ32L8X)

   $0.30 -- MicroPak 8 Packaged ULP D-Type Flip Flop (NC7SP74L8X)

   $0.27 -- MicroPak 8 Packaged UHS D-Type Flip Flop (NC7SZ74L8X)

   $0.27 -- MicroPak 8 Packaged UHS Dual Buffer with 3-State Output
            (NC7WZ126LX)

   $0.27 -- MicroPak 8 Packaged UHS Triple Inverter (NC7NZ04L8X)

Availability: Now

Delivery:     2-3 weeks ARO

Editor's Note: For more information about this product, go to http://www.fairchildsemi.com/micropak. For information on other Fairchild products, design tools and sales contacts, visit http://www.fairchildsemi.com.

Fairchild Semiconductor International:

Fairchild Semiconductor International (NYSE:FCS) is a leading global supplier of high performance products for multiple end markets. With a focus on developing leading edge power and interface solutions to enable the electronics of today and tomorrow, Fairchild's components are used in computing, communications, consumer, industrial and automotive applications. Fairchild's 10,000 employees design, manufacture and market power, analog & mixed signal, interface, logic, and optoelectronics products from its headquarters in South Portland, Maine, and numerous locations around the world. Contact us on the Web at www.fairchildsemi.com.