FUJITSU INTRODUCES STACKED MCPS WITH NAND FLASH MEMORY AND FCRAM.Fujitsu Microelectronics has introduced stacked multi-chip packages (MCPs) that incorporate high-density NAND Flash memory and Fast Cycle RAM (FCRAM FCRAM Fast Cycle Random Access Memory FCRAM Fast Cycle Ram ), developed to provide the speed, density and cost-efficiency required for data storage in the next generation of mobile information terminals. The functions and services available to users of these mobile information terminals, particularly cellular phones, including e-mail and image transmission, viewing and downloading of home pages and, more recently, playing high-quality video games, continue to expand dramatically. Fujitsu's new MB84VN23381EJ and MB84VN23391EJ MCP (1) See Microsoft certification. (2) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C). devices provide 64Mbit NAND-type Flash memory and 16Mbit FCRAM with a static RAM interface. The NAND Flash enables page programming in 200 microseconds, random read access in 10 milliseconds, serial read access in 70 nanoseconds max within a page and small block erasure ERASURE, contracts, evidence. The obliteration of a writing; it will render it void or not under the same circumstances as an interlineation. (q.v.) Vide 5 Pet. S. C. R. 560; 11 Co. 88; 4 Cruise, Dig. 368; 13 Vin. Ab. 41; Fitzg. 207; 5 Bing. R. 183; 3 C. & P. 65; 2 Wend. R. 555; 11 Conn. in just 2 milliseconds. The random read access time for the FCRAM SRAM See static RAM. SRAM - static random-access memory interface is 90 nanoseconds per word. The new MCP accommodates large files, and can rewrite and erase the particularly high volume of serial data required for video applications. The NAND-type Flash memory uses a x16 configuration, enabling a two-fold speed increase to be achieved compared with the x8-configuration of NAND (Not AND) A Boolean logic operation that is true if any single input is false. Two-input NAND gates are often used as the sole logic element on gate array chips, because all Boolean operations can be created from NAND gates. See flash memory. products now available for cellular phone design. The MB84VN23381EJ includes a common data I/O port for Flash and FCRAM, while the ports on the MB84VN23391EJ are separate. Samples of the new devices are now available in plastic BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. packages, measuring just 11mm x 12mm x 1.4mm, with a pitch of 0.8mm. |
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