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FUJITSU INTRODUCES NEW MULTI-CHIP PACKAGE.


Fujitsu Limited and Fujitsu Microelectronics Inc. (FMI FMI Fondo Monetario Internacional (Spanish: International Monetary Fund)
FMI Fonds Monétaire International
FMI For More Information
FMI Food Marketing Institute
FMI Fundo Monetário Internacional
) introduced three versions of the industry's first Multi-Chip Packages (MCPs) with stacked flash memory and Fujitsu's popular Fast Cycle RAM (FCRAM FCRAM Fast Cycle Random Access Memory
FCRAM Fast Cycle Ram
). The new stacked packages are designed to meet the high-density memory, small-footprint and low power requirements of coming generations of cellular telephones.

The new flash and FCRAM-stacked MCPs utilize the company's "FlexBank" architecture, including 64 Mbit dual-operation flash memory and 16 Mbit FCRAM with an asynchronous Refers to events that are not synchronized, or coordinated, in time. The following are considered asynchronous operations. The interval between transmitting A and B is not the same as between B and C. The ability to initiate a transmission at either end.  Static RAM A fast memory technology that requires power to hold its content. Static RAM (SRAM, S-RAM) is used for high-speed registers, caches and relatively small memory banks such as a frame buffer on a display adapter.  (SRAM See static RAM.

SRAM - static random-access memory
) interface. In contrast, the current generation of MCPs with flash memory and SRAM for cellular phones provides a maximum of only 8 Mbit memory density. The MCPs also feature 2.3V to 2.7V operations, provided by Fujitsu's FCRAM low-power capability.

Along with the new flash/FCRAM MCPs, Fujitsu also announced that it is strengthening its MCP (1) See Microsoft certification.

(2) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C).
 line-up with nine new versions of the industry's most compact MCPs, linking flash memory and SRAM together in a single package. These include MCPs with stacked 16 Mbit dual-operation flash memory and 2 and 4 Mbit SRAM. At 7.0mm x 7.2mm x 1.2mm, the new flash/SRAM MCPs are the smallest in the industry and only half the size of the previous version.

The cellular phone market has expanded rapidly worldwide; Cellular phones now provide new value-added applications such as mobile banking and ticket reservations. The Japanese market will lead the industry with the introduction of the next-generation cellular phone system, the IMT-2000, in May 2001. IMT-2000 will let users download animation or graphics from the Internet. In addition, IMT-2000 is expected to transfer data at 384 Kbit, six times the current rate. To provide these features and services, next-generation cellular phone systems like the IMT-2000 will require higher density memory, lower power operation and smaller packages.
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Title Annotation:Company Business and Marketing
Comment:FUJITSU INTRODUCES NEW MULTI-CHIP PACKAGE.(Company Business and Marketing)
Publication:EDP Weekly's IT Monitor
Geographic Code:1USA
Date:Jul 10, 2000
Words:294
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