FSI International Receives Multiple Follow-on ANTARES(R) Orders from a Leading Worldwide Foundry.

In-line Parametric Test Clean Up Recovers Yield Losses

MINNEAPOLIS -- FSI International, Inc. (Nasdaq:FSII) announced today that a leading Asia-based foundry has placed a repeat order for multiple ANTARES([R]) CyroKinetic Cleaning Systems, further broadening the platform's installed base. The order was driven by the tool's ability to eliminate manufacturing contamination created by in-line DC parametric testing, which is reported to cause manufacturing yield losses. This foundry currently employs the ANTARES system for various FEOL and BEOL particle removal processes, and with this order is adding capacity for more in-line parametric test clean up at the 65 and 90nm technology generations. The systems are expected to ship over the next several quarters. The ANTARES systems typically range in price from $1.2 to $2.0 million, depending on configuration.

In-line parametric testing after transistor formation, at the mid-point in the manufacturing process, enables IC makers to determine if device parameters are within specification. While in-line testing is valuable for controlling the manufacturing process, testing can introduce contamination, causing chips or entire wafers to be scrapped. The ANTARES system eliminates this risk by removing test contamination and allowing IC makers to perform in-line testing without sacrificing the test chips or wafer. In addition, the ANTARES system's innovative aerosol cleaning capabilities enable increased testing frequency, thus allowing even more monitoring of manufacturing WIP without yield loss, which is especially important as newer technologies are brought online.

"We're very pleased to offer a process that directly impacts this customer's bottom line," said Don Mitchell, FSI International chairman and CEO. "By providing our customer with an effective way to do in-line parametric test clean up, they benefit from higher test wafer yield and revenue, a further testament to FSI's ability to provide the industry with some of the most cost effective cleaning solutions available today."

Currently, more than 10 leading device manufacturers worldwide utilize the ANTARES system for its defect reduction and yield improvement benefits, and over half of these customers use the ANTARES system for in-line parametric test cleaning.

The ANTARES([R]) System is a fully automated, single-wafer, CryoKinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. CryoKinetic processing technology is an all-dry, non-reactive process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films. The ANTARES system's highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL:

* AspectClean[TM] process is especially suited to pattern sensitive steps from FEOL gate through contact where the industry is increasingly seeking a damage-free zero etch particle removal process.

* N2Clean[TM] process offers risk-free cleaning of damascene features in BEOL Cu flows and is an ideal clean for post CuCMP, etch-stop deposition, in-line probe and low-k via structures.

FSI International, Inc. is a global supplier of surface conditioning equipment technology and support services for microelectronics manufacturing. Using the Company's broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray, vapor and CryoKinetic technologies, customers are able to achieve their process performance, flexibility and productivity goals. The Company's support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment. FSI maintains a web site at http://www.fsi-intl.com.