FAMILY OF SWITCHING REGULATOR POWER ICs BREAKS THE 1 MHz
BARRIER AND LETS DESIGNERS APPLY EFFICIENT PWM FIXED FREQUENCY
SWITCHING TECHNIQUES TO MINATURIZED HIGH-SPEED APPLICATIONS
2X Higher Frequency Performance, 17X Faster Output
Rise and Fall Times Over Closest Competitor
MELBOURNE, Fla., Nov. 5 /PRNewswire/ -- Harris has introduced the world's first family of switching regulator power ICs to break the 1 MHz barrier. At 1 MHz, the three HIP506X series chips can switch up to 10 amps at 60 volts DC in less than 3 nanoseconds with ultra-low switching losses (6 watts) in power supply applications up to 100 watts. Co- developed by Harris Semiconductor and IBM, these chips let power system designers for the first time employ universally preferred current mode controlled PWM (pulse width modulation) fixed frequency switching techniques (instead of resonant mode techniques) to produce miniaturized power supplies exceeding 1 MHz. Miniaturization, which allows use of surface mount technology, is crucial to many applications driven by size, cost and reliability, such as distributed power architectures for computer systems.
No IC or discrete solution has ever approached this performance. Until now, the highest performance available from a one-chip power supply with MOS outputs was 500 KHz, and capable of switching 10 amps in 50 nanoseconds with 18 watts power dissipation (SGS L4970). Discrete PWM implementations are generally prohibitive above a few hundred kilohertz. Parasitic capacitance and lead inductance associated with separately packaged MOSFETs, gated drivers and wiring produce excessive switching losses that are at best equal to the old IC alternative.
The new chips, called HIP5060, HIP5062 and HIP5063, are complete power control ICs that include one or two high-power lateral DMOS transistors (10A and 60V), CMOS logic and low-level high-speed analog circuitry on one chip. All three chips were initially designed as ASIC circuits using Harris Semiconductor's intelligent power technology (a BiCMOS/DMOS process called Power ASIC) on the company's Mixed Signal FASTRACK ASIC Design System. Power ASIC, also co-developed with IBM, was announced in July 1990 and is the industry's first cell-based intelligent power offering.
IBM has used these chips in distributed power applications in its own computers and peripherals, and has recently granted Harris rights to offer the new ICs as standard products. Distributed power architectures overcome the limitations of centralized power architectures by reducing load and line interference, time to market, component count, system size and cost, while significantly increasing reliability. An IBM 1 MHz triple output DC-DC converter using the Harris ICs operates from 30 to 40 volt DC inputs and features 82-percent efficiency at an 88-watt maximum load. This converter measures just 4.30 x 2.15 by 0.35 inches. Based on IBM's experience, system reliability with this DC-DC converter can exceed 5 million hours MTBF (mean-time between failures). The present industry reliability standard is 200,000 to one million hours MTBF.
MANY TOPOLOGIES AND APPLICATIONS
Designers can use one HIP506X IC to easily implement low-side switching topologies (boost, forward and flyback circuits) as well as emerging topologies such as SEPIC (Single-Ended Primary Industance Converter), quadratic (D2) and Cuk.
Applications include single-chip power supplies, current-model PWM (pulse width modulation), multiple output DC-DC converters and distributed power supplies.
End system applications include computers ranging from mainframes to desktops, computer peripherals, instrumentation for a variety of end markets, and OEM power supplies.
With the addition of output diodes, the HIP506X family becomes the only required silicon to provide a fully functional and protected converter. A complete converter would require one or more inductors, several capacitors and resistors and done or more power diodes.
WHY THE HIP506X FAMILY CREATES A NEW-TO-THE-WORLD CAPABILITY
The HIP506X family's high frequency, high speed and unique architecture lets designers, for the first time, combine miniaturization (defined as more than 50 watts per cubic inch) with high-reliability PWM switching techniques. The speed and frequency allow incorporation of very small inductors and capacitors, which contributes to miniaturization and low switching loss. The architecture lets designers use PWM fixed frequency switching for easier filtering in miniature designs instead of less preferred resonant mode switching.
Miniaturization (which allows the use of surface mount magnetics and capacitors), is crucial to many emerging applications driven by size, cost and increased reliability.
Historically, power supply designers facing miniaturization requirements have been forced to employ resonant or quasi-resonant switching schemes rather than the preferred approach, fixed-frequency hard PWM switching techniques. While resonant switching schemes provide softer switching, serious disadvantages include widely varying frequency, difficulty in filtering noise from the end system, and higher component voltage ratings. Resonant circuits cause higher component stress, have poorer silicon utilization due to high peak voltages and have higher conduction losses. For the same silicon size, resonant techniques produce less power than PWM. By providing ultra-fast rise and fall times (3 ns), the HIP506X family eliminates the primary reason why resonant converters are used: low switching losses.
FAMILY MEMBERS & KEY SPECIFICATIONS
The three HIP506X power control ICs are the HIP5060, HIP5062 and HIP5063. HIP5060 (27 to 45V operation) and HIP5063 (10 to 45V operation) are single output switching regulators. The HIP5060 and HIP5063 each feature a 60V, 10 amp on-chip lateral DMOS transistor. This allows development of maximum 100-watt power supplies. The HIP5062 (26 to 42V operation) single chip dual switching supply, with two on- chip, 60V, 5 amp DMOS transistors, enables the design of two independent DC-DC converters. By adding an extra low-current winding to the HIP5062, the designer can construct a triple output supply. The HIP5063, which offers the same basic function as the HIP5060, requires additional circuitry, including a clock reference and an amplifier for loop closure. The HIP5063 is the simplest and most flexible product in the family. Wideband power amplifiers for motor control are an additional application for the HIP5063.
Features common to all three chips include typical 1 MHz frequency operation and typical 3 nanosecond output rise and fall times. Special on-chip power transistor current sensing circuitry, used in overcurrent protection, minimizes losses through use of non-dissipative current sensing. Pulse-by-pulse current limiting, as well as overcurrent protection, are also included. In addition, the HIP5060 and HIP5062 include on-chip over-temperature and overvoltage detection functions to monitor chip temperature and the actual power supply output voltage (the HIP5063 does not include overvoltage detection). These circuits can disable the drive to the power transistor to protect the transistor and the load from overvoltage. The HIP5060 and HIP5062 include a 5.1V on- chip voltage reference. The HIP506X family is intended for systems meeting UL Safe Extra Low Voltage (SELV) requirements for faster regulatory approval cycles.
Key specifications include 60V DC maximum voltage; 10A DC output current; 0.13 Ohms RDS (ON) at 25 degrees Centigrade (0.22 Ohms for each output of the dual HIP5062) for high efficiency; 3 nanosecond DMOS switching for low switch loss; and 6 watts power dissipation at 1 MHz (in a 10 amp circuit). Operating temperature range is 0-110 degrees Centigrade.
PRICE AND AVAILABILITY
All HI506X family members are available from stock in die form to manufacturers with hybrid chip handling or COB (chip-on-board) capabilities, such as OEM power supply manufacturers and computer manufacturers. In quantities of 1,000 the HIP5060 costs $6.18; the HIP5062 costs $7.33; and the HIP5063 costs $4.33. Surface mount packages will be available during the first half of calendar 1993.
Designers can mount the die on conventional ceramics as well as thermally enhanced board material (from companies such as Berquist, etc,). Thermal carriers for use with the HIP506X family are available through IBM Power Systems, Endicott, NY (telephone 607/75-POWER).
The HIP506X family is an example of Harris' strategic focus on intelligent power for power supply applications. Two other equally important Harris intelligent power application areas include power interface and motion control. End markets include EDP, automotive/transportation, industrial, communications and consumer.
In addition to Power ASIC, the industry's first cell-based intelligent power semicustom offering on the Harris FASTRACK design system, Harris offers full-custom services as well as standard products. Harris intelligent power products are built from an extensive portfolio of robust power BiCMOS technologies optimized for target application requirements.
Harris Corporation's Semiconductor Sector manufactures discrete semiconductors and integrated circuits for analog and digital signal processing and power applications. It is the number one supplier to the military and aerospace market and the seventh largest U.S. merchant semiconductor manufacturer. Harris Corporation (NYSE: HRS), with worldwide sales of more than $3 billion, is focused on four major businesses: electronic systems, semiconductors, communications, and office equipment.
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CONTACT: Linda da Costa of Harris Semiconductor Sector, 407-724-3704./
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JB-JJ -- FL009 -- 7822 11/05/92 14:57 EST