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Exposure tool.


The UVE UVE User Virtual Environment  M720 manual exposure unit for soldermask imaging uses high output metal halide lamps Metal halide lamps, a member of the high-intensity discharge (HID) family of lamps, produce high light output for their size, making them a compact, powerful, and efficient light source.  that reportedly deliver over 60 Mw/cm2 output at the image plane, and dual 24" x 36" exposure frames to ensure high throughput. The UVEM525 high performance soldermask system uses an in-frame dual target/dual camera CCD CCD
 in full charge-coupled device

Semiconductor device in which the individual semiconductor components are connected so that the electrical charge at the output of one device provides the input to the next device.
 registration system and glass/glass tooling said to ensure proper substrate The base layer of a structure such as a chip, multichip module (MCM), printed circuit board or disk platter. Silicon is the most widely used substrate for chips. Fiberglass (FR4) is mostly used for printed circuit boards, and ceramic is used for MCMs.  alignment and the ability to photo pattern very fine line geometries.

WHO: C Sun Manufacturing Ltd.

WEB: wwww.csun.com.tw

[ILLUSTRATION OMITTED]
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No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2006, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Title Annotation:off the SHELF
Publication:Printed Circuit Design & Manufacture
Date:Oct 1, 2006
Words:86
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