Elpida Memory Delivers Industry's Highest Density DRAM Modules for Notebook and Mobile Computers.Business Editors/High-Tech Writers TOKYO--(BUSINESS WIRE)--Oct. 15, 2001 512 MByte Small Outline DIMMs Enable Notebook Computers to Offer Same Density as Desktop Computers Elpida Memory Elpida Memory, Inc. (エルピーダメモリ株式会社 , Inc. (Elpida), the industry's only major semiconductor company to focus completely on DRAM, announced today the availability of its 512 MByte Small Outline (S.O.) Dual In-line Memory Modules (DIMMs) for notebook and mobile computing Using a computing device while in transit. Mobile computing implies wireless transmission, but wireless transmission does not necessarily imply mobile computing. Fixed wireless applications use satellites, radio systems and lasers to transmit between permanent objects such as buildings applications. "Elpida's new 512 MByte S.O. DIMMs are currently the highest density S.O. DIMMs available," according to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. Yasu Yoshitomi, technical marketing manager for Elpida Memory (USA) Inc. "Notebook and mobile computers are rapidly replacing desktop computers in the home and work environments, and higher memory density for these computers is currently in great demand. Elpida's new modules enable notebook and mobile computers to have as much memory as desktop systems." Elpida's 512 MByte S.O. DIMMs, measuring 67.6 mm (length) x 31.75 mm (height) x 3.8 mm (thickness), are fully compatible with the JEDEC The division of the Electronic Industries Alliance (EIA) that deals with semiconductor standards (officially, the JEDEC Solid State Technology Association of EIA). JEDEC was formed in 1958 when the Joint Electron Tube Engineering Council (JETEC) split into two Joint Electron Device industry standard specification for 8-Byte (x64) S.O. DIMMs. The S.O. DIMM (Dual In-Line Memory Module) A printed circuit board that holds memory chips and plugs into a DIMM socket on the motherboard. See memory module. DIMM - Dual In-Line Memory Module form factor was first introduced in 1990 to allow notebook computers to save space while maximizing the amount of system memory. It is 63% smaller than the standard DIMM form factor used in desktop applications. Until now, the maximum memory density per S.O. DIMM was 256 Mbytes. Elpida's 512 MByte S.O. DIMMs feature a x64-bit configuration, 2 memory banks, 3.3 V power supply voltage, a low self-refresh current, PC133/PC100 compatibility, and a 144-pin zig zag Zig Zag A technical analysis indicator that filters out changes in an underlying plot that are less than a specified amount. Notes: In other words, it helps to show only significant changes. See also: Indicator, Technical Analysis dual tab with a lead pitch of 0.80 mm for dual lead-out sockets. They are unbuffered for PC applications. These modules are also supported by several chipsets designed specifically for notebook applications. Device Packaging Doubles the DIMM Density To double the density of these modules, Elpida uses its proven, stacked Tape Carrier Packaging (TCP (1) (Transmission Control Protocol) The reliable transport protocol within the TCP/IP protocol suite. TCP ensures that all data arrive accurately and 100% intact at the other end. ) technology for each of the sixteen 256 Mbit (32 Mbit x 8 bit) Synchronous DRAM (SDRAM (Synchronous DRAM) A type of dynamic RAM (DRAM) memory chip that has been widely used since the late 1990s. SDRAM chips eliminated wait states by dividing the chip into two cell blocks and interleaving data between them. ) devices that fit on each module. The memory bus clock frequency operates at 133 MHz (MegaHertZ) One million cycles per second. It is used to measure the transmission speed of electronic devices, including channels, buses and the computer's internal clock. A one-megahertz clock (1 MHz) means some number of bits (16, 32, 64, etc. (PC133) or 100 MHz (PC100) with a CAS latency (CL) of 3 or 2, respectively.
Price and Availability
Elpida Part Number Description Availability Price (1000s)
HB52RF648DC-75B 512 MByte, unbuffered, Samples now; $330.00
x64 PC133 S.O. DIMM volume now
HB52RD648DC-A6B/B6B 512 MByte, unbuffered, Samples now; $300.00
x64 PC100 S.O. DIMM volume now
About Elpida Memory, Inc. Elpida Memory, Inc. is a global corporation with headquarters based in Tokyo, Japan, and sales and marketing operations located in Japan, North America, Europe and Asia. Elpida's research, design and development operations were merged from NEC (NEC Corporation, Tokyo, www.nec.com, www.necus.com) An electronics conglomerate known in the U.S. for its monitors. In Japan, it had the lion's share of the PC market until the late 1990s (see PC 98). NEC was founded in Tokyo in 1899 as Nippon Electric Company, Ltd. and Hitachi on April 1, 2000 and sales and marketing operations commenced in Q1, 2001. Elpida's entire DRAM semiconductor product line is now marketed under the Elpida brand name and includes DRAM devices and modules inherited from both NEC and Hitachi, as well as new products designed and developed by Elpida. Elpida's main DRAM foundries are located at NEC Hiroshima and Hitachi Nippon Steel Semiconductor Singapore. Elpida's own 300 mm DRAM wafer manufacturing facility is scheduled to begin production by January 2003. For datasheets and more information, visit Elpida's World Wide Web site at www.elpida.com |
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