Electroglas appoints Timothy J. Boyle as vice president of engineering; new position to drive all functions of engineering organization.

SANTA CLARA, Calif.--(BUSINESS WIRE)--May 3, 1995--Electroglas Inc. (NASDAQ:EGLS), a leading supplier of automated wafer probing systems to the worldwide semiconductor industry, today announced it has appointed Timothy J. Boyle to the position of vice president of engineering.

Formerly vice president of hardware and sensor engineering at Measurex Corp., Boyle will report to Electroglas' President and Chief Operating Officer Bill Cornwell.

According to Cornwell, "Electroglas has experienced phenomenal growth in recent years, and our production-proven technology, as well as our planned future technology, requires focused leadership and ongoing product evolution so that we can continue to meet our customers' needs. Tim has a strong track record in managing engineering, quality and product development resources, and brings to this new position the kind of education and experience that will help ensure our continued growth and success."

Boyle is charged with driving the activities of the company's 100-plus-member engineering organization across all product lines. "Electroglas is a dynamic company with exciting technology incorporated into its products," said Boyle. "I look forward to working with both the engineering and management teams to pursue new opportunities that will help the company maintain its technological and market leadership."

Boyle spent 12 years with Measurex in a succession of key engineering and management positions. Prior to that, he was vice president of engineering with American Flow Systems, a startup company for which he co-invented a patented fluid flow sensing technique for use in industrial processes. He also held previous technical positions with Hewlett-Packard Co. and Varian Associates.

A graduate of the M.B.A. program at Santa Clara University, Boyle is also a former member of the university's M.B.A. board of directors. He additionally holds a master's in electrical engineering from Stanford University and a bachelor's in engineering physics from University of California at Berkeley.

About Electroglas: Founded in 1960, Electroglas Inc. is a world-leading supplier of the automated wafer-probing products that semiconductor manufacturers rely on to sort and classify integrated circuits. The company's products position semiconductor devices that are still in wafer form under contact probes to facilitate accurate, rapid, reliable testing, and manage information collected during the testing process. Electroglas' common stock is traded on the Nasdaq Stock Market under the trading symbol EGLS.

CONTACT: Electroglas Inc.

Yolanda Ruiz, 408/727-6500

fax: [phone]

or

MCA Inc.

Lisa Gillette, 415/968-8900

fax: [phone]