Electroglas Unveils Industry's Most Advanced High-Force Probing Solution; HFZ-2 is the only Z-stage option addressing flip-chip C4 and massively parallel technologies.

SANTA CLARA, Calif.--(BUSINESS WIRE)--July 16, 1997-- Electroglas, Inc. (NASDAQ:EGLS), a market-leading supplier of automatic wafer probing and information management products to the global semiconductor industry, and pioneer of fully integrated sort floor networked communications, today introduced the HFZ-2 high-force probing solution -- a new Z-stage option with low-compliance chucktops -- for its line of Horizon 4080X(R), flagship Horizon 4090 and the recently announced Horizon 4090micro automatic wafer probers.

Meeting the extremely high-force probe touchdowns required by emerging technologies, the HFZ-2 addresses flip-chip and C4 (controlled-collapse chip connection) technologies of next-generation ultra-large scale integration (ULSI) application-specific integrated circuit (ASIC) and microprocessor devices. The HFZ-2 also addresses massively parallel technologies required for the production of next-generation 64Mb and 256Mb memory devices.

According to Electroglas, the HFZ-2, supporting Cobra, Vertical and Membrane probe card technologies, represents another significant step in providing its customers with the leading-edge probing solutions required to support both current- and future-generation semiconductor production.

Phillip Truckle, Electroglas vice president of marketing, noted, "Identifying emerging market challenges and developing state-of-the-art probing solutions for our customers remains a primary focus at Electroglas."

Truckle continued, "The HFZ-2 is the only solution currently available that supports the most advanced probe card technologies and meets the stringent high-force probing performance criteria associated with the production of next-generation ICs."

Enabling chipmakers to probe effectively in the high-pin count applications of next-generation devices, the HFZ-2 generates probing forces up to 70kg, outperforming all competitive offerings, which range below 25kg of probing force capability. David Durham, Electroglas director of prober product marketing, said, "While this exceeds the current requirements of most chipmakers, the HFZ-2 is very attractive to our customers for its ability to cost-effectively support their technology roadmap far into the future."

An integral part of the HFZ-2 is a new series of low-compliance chucktops, which offer maximized stiffness and flatness during probing. The HFZ-2 may be configured with a variety of these chucktops, including ambient and EG General Purpose Hot Chuck.

With the same footprint of Electroglas' other Z-stage solution, the HFZ-2 is a plug-and-play option immediately integrated into all of the EGCommander-based Horizon Series probers. Electroglas will be featuring the HFZ-2 on a Horizon 4090micro wafer prober at its booth, No. 11221, during the SEMICON/West exhibition and conference from July 16-18, at the San Jose Convention Center -- the Test, Assembly & Packaging portion of the exhibition.

Except for statements of historical fact, the statements in this press release are forward-looking. Such statements are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include semiconductor industry cycles, risks associated with the acceptance of new products and product capabilities, and other factors detailed in the Company's reports on Forms 10-K and 10-Q, and annual report to shareholders.

About Electroglas: Founded in 1960, Electroglas, Inc. is a world-leading supplier of the automated wafer-probing products and information management products that semiconductor manufacturers rely on to sort and classify integrated circuits. The company's products position semiconductor devices that are still in wafer form under contact probes to facilitate accurate, rapid, reliable testing, and manage information collected during the testing process.

In May 1997, Electroglas finalized its acquisition of Knights Technology. Knights Technology is now a wholly owned subsidiary of Electroglas. Electroglas' common stock is traded on the Nasdaq National Market under the trading symbol EGLS. Electroglas' home page on the World Wide Web is located at http://www.electroglas.com .

CONTACT: MCA, Inc.

Vincent Mayeda, 415/968-8900

or

Electroglas, Inc.

Yolanda Ruiz, 408/727-6500