Electroglas Introduces the Fastest Wafer Inspection System for Full Die Screening At Test and Assembly.

Business Editors/High-Tech Writers

SEMICON Europa 2001

MUNICH, Germany--(BUSINESS WIRE)--April 24, 2001

QuickSilver IIe Detects and Automatically Classifies All Surface

Defects On Semiconductor Wafers Before or After Die

Probing and Analyzes Probe Marks

Electroglas, Inc. (Nasdaq:EGLS), a leading supplier of process management tools for the semiconductor industry, today introduces QuickSilver IIe(TM), an inspection system for the automatic identification and classification of defects on processed semiconductor wafers at production rates. The system detects and automatically classifies defects as small as 1 micron. It screens such flaws as passivation voids, scratches and debris on the surface of wafers, while reporting the inspection data to regulate fabrication processes. Moreover, QuickSilver IIe examines and provides detailed analyses of probe marks.

The high-speed optical instrument provides unequalled throughput and accuracy for wafer inspection at assembly and test, thanks to an Advanced Imaging Platform (AIP(TM)) that incorporates a dedicated multi-processor computer, fiber-optic link, proprietary TDI CCD scanning camera, and an ultra-high-capacity buffer for capturing comprehensive images of even the largest die. With the tool, IDMs and contract manufacturers can inspect incoming wafers from a fab, generate defect maps before or after wafer bumping, and determine the quality of probing operations. No manual or alternative automated inspection method available today matches the productivity of the QuickSilver IIe. The proprietary TDI camera -- a feature exclusive to the Electroglas system -- continually scans wafers under constant bright illumination while vision algorithms enable the discrimination and classification of bump defects as well as surface defects, thereby producing unrivalled inspection coverage at the lowest possible cost.

"Electroglas Inspection Products has migrated the technology of multi-million-dollar, front-end wafer inspection systems into a low-cost-of-ownership product," said John R. Dralla, vice president of marketing and sales. "Electroglas and only Electroglas has applied that advanced technology to test and assembly operations, which are very sensitive to manufacturing cost."

The inspection system is supported by QuickLook(TM), which is an offline software tool for enhanced visualization of die, wafer and lot data. QuickLook allows detailed analyses and comparison of defect data by organizing and presenting wafer maps, defect maps, measurement files and images from one or multiple QuickSilver inspection systems. Process trends and problems can be readily identified by displays and graphs that QuickLook creates from QuickSilver inspection data and data from networked wafer probers manufactured by Electroglas and other suppliers. QuickSilver IIe data is fully integrated with test electrical data via SORTnet(TM), YieldManager(TM) and other such networking and process management software products from Electroglas.

For more information, contact the Electroglas Inspection Products Division in Corvallis, Ore. at 541/738-2200 or visit www.electroglas.com.

About Electroglas, Inc.

Electroglas delivers essential tools for process management to enhance the profitability of semiconductor manufacturers. The company's wafer probers, inspection systems and software solutions serve as data collection, management and analysis tools that semiconductor manufacturers depend upon to improve their productivity and process control by optimizing sort-floor efficiency. Electroglas has been a leading supplier of wafer probers for over 35 years and has an installed base of more than 15,000 systems. The company's stock trades on the NASDAQ National Market under the symbol "EGLS". The company's World Wide Web site is located at www.electroglas.com.

Note to Editors: QuickSilver, QuickLook, SORTnet and YieldManager are trademarks of Electroglas, Inc. Other trademarks are property of their respective holders.