Electroglas Introduces the Fastest Wafer Inspection System for Full Die Screening At Test and Assembly.Business Editors/High-Tech Writers
SEMICON SEMICON Semiconductors Equipment and Material International Conference Europa 2001
MUNICH, Germany--(BUSINESS WIRE)--April 24, 2001
QuickSilver quicksilver: see mercury.
(1) (QuickSilver Technology, Inc., San Jose, CA, www.qstech.com) A mobile communications company that specializes in a reconfigurable logic chip for cellphones and PDAs. See adaptive computing. IIe Detects and Automatically Classifies All Surface
Defects On Semiconductor Wafers Before or After Die
Probing and Analyzes Probe Marks
Electroglas, Inc. (Nasdaq:EGLS EGLS Eastside German Language School (Issaquah, WA) ), a leading supplier of process management tools for the semiconductor industry, today introduces QuickSilver IIe(TM), an inspection system for the automatic identification and classification of defects on processed semiconductor wafers at production rates. The system detects and automatically classifies defects as small as 1 micron micron: see micrometer.
One micrometer, which is one millionth of a meter or approximately 1/25,000 of an inch. The tiny elements that make up a transistor on a chip are measured in micrometers and nanometers. See process technology. . It screens such flaws as passivation passivation
the final stage in instrument manufacture, passing the finished instruments through a bath of nitric acid which removes foreign particles and promotes the formation of a protective coating of chromium oxide. voids, scratches and debris on the surface of wafers, while reporting the inspection data to regulate fabrication fabrication (fab´rikā´shn),
n the construction or making of a restoration. processes. Moreover, QuickSilver IIe examines and provides detailed analyses of probe marks.
The high-speed optical instrument provides unequalled throughput and accuracy for wafer inspection at assembly and test, thanks to an Advanced Imaging Platform (AIP AIP acute intermittent porphyria.
AIP Acute intermittent porphyria (TM)) that incorporates a dedicated multi-processor computer, fiber-optic link, proprietary TDI TDI - Transport Driver Interface CCD CCD
in full charge-coupled device
Semiconductor device in which the individual semiconductor components are connected so that the electrical charge at the output of one device provides the input to the next device. scanning camera, and an ultra-high-capacity buffer for capturing comprehensive images of even the largest die. With the tool, IDMs and contract manufacturers can inspect incoming wafers from a fab, generate defect maps before or after wafer bumping, and determine the quality of probing operations. No manual or alternative automated inspection method available today matches the productivity of the QuickSilver IIe. The proprietary TDI camera -- a feature exclusive to the Electroglas system -- continually scans wafers under constant bright illumination while vision algorithms enable the discrimination and classification of bump defects as well as surface defects, thereby producing unrivalled inspection coverage at the lowest possible cost.
"Electroglas Inspection Products has migrated the technology of multi-million-dollar, front-end wafer inspection systems into a low-cost-of-ownership product," said John R. Dralla, vice president of marketing and sales. "Electroglas and only Electroglas has applied that advanced technology to test and assembly operations, which are very sensitive to manufacturing cost."
The inspection system is supported by QuickLook(TM), which is an offline software tool for enhanced visualization Using the computer to convert data into picture form. The most basic visualization is that of turning transaction data and summary information into charts and graphs. Visualization is used in computer-aided design (CAD) to render screen images into 3D models that can be viewed from all of die, wafer and lot data. QuickLook allows detailed analyses and comparison of defect data by organizing and presenting wafer maps, defect maps, measurement files and images from one or multiple QuickSilver inspection systems. Process trends and problems can be readily identified by displays and graphs that QuickLook creates from QuickSilver inspection data and data from networked wafer probers The introduction to this article provides insufficient context for those unfamiliar with the subject matter.
Please help [ improve the introduction] to meet Wikipedia's layout standards. You can discuss the issue on the talk page. manufactured by Electroglas and other suppliers. QuickSilver IIe data is fully integrated with test electrical data via SORTnet(TM), YieldManager(TM) and other such networking and process management software products from Electroglas.
For more information, contact the Electroglas Inspection Products Division in Corvallis, Ore. at 541/738-2200 or visit www.electroglas.com.
About Electroglas, Inc.
Electroglas delivers essential tools for process management to enhance the profitability of semiconductor manufacturers. The company's wafer probers, inspection systems and software solutions serve as data collection, management and analysis tools that semiconductor manufacturers depend upon to improve their productivity and process control by optimizing sort-floor efficiency. Electroglas has been a leading supplier of wafer probers for over 35 years and has an installed base of more than 15,000 systems. The company's stock trades on the NASDAQ National Market under the symbol "EGLS". The company's World Wide Web site is located at www.electroglas.com.
Note to Editors: QuickSilver, QuickLook, SORTnet and YieldManager are trademarks of Electroglas, Inc. Other trademarks are property of their respective holders.