Electroglas Introduces Advanced-Capability Direct Probe Sensor -- DPS -- for New Horizon 4090 Automatic Wafer Prober; New DPS II provides enhanced probing automation and accuracy for next-generation devices.

SANTA CLARA, Calif.--(BUSINESS WIRE)--July 16, 1996--Electroglas Inc. (NASDAQ:EGLS), a market-leading supplier of automatic wafer probing systems to the worldwide semiconductor industry, today unveiled the enhanced Direct Probe Sensor (DPS II) option for the new, state-of-the-art Horizon 4090 wafer prober.

Designed to meet the sophisticated probing requirements of advanced devices, the fully integrated DPS II features automatic probe-to-pad alignment (APTPA), which significantly increases productivity by minimizing process variability during system set-up and eliminating operator intervention during system operation.

Electroglas reports that shrinking bond pad geometries, multi-die array applications, growing test head sizes and next-generation probe card technologies are driving the automation of probe-to-pad alignment. Current probe technologies, such as cantilever probes, preclude contact on smaller pad sizes.

As new vertical probe card technologies emerge, the use of microscopes becomes impractical for probe-to-pad alignment on next-generation devices. These include high-pin-count application-specific integrated circuits (ASICs), advanced microprocessors and 64-megabit and larger dynamic random-access memories (DRAMs).

The optics system of the new DPS II was built from the ground up, implementing highly advanced machine-vision technology and software that enables enhanced image resolution and clarification as well as automatic alignment of probe tips to bond pads.

Leveraging the power of two charge-coupled device (CCD) cameras, the DPS II achieves highly accurate probe-to-pad alignment without the use of microscopes, maximizing alignment accuracy for enhanced yield potential.

The upward and downward looking CCD cameras perform both high and low magnification to automatically determine x, y and theta coordinates and z-height of probe tips with no human intervention. Probe-to-pad alignment can be further optimized with a user-selectable detection and alignment option, referencing just a few or up to 600 probes per single- or multiple-die array.

According to David Durham, director of prober product marketing, the DPS II utilizes new technology specifically focused on increasing the productivity of advanced device manufacturers. Incorporating vision and software advancements, DPS II provides a level of automation that will significantly increase capital utilization and minimize user intervention.

"Automation is an important factor in providing our customers with a competitive edge. Our customers need versatile, strategic automation capabilities that support both current and future probing applications so that they are well positioned to implement emerging technologies. The DPS II was created to meet this challenge," stated Durham.

Currently in the final stages of beta testing, the new DPS II supports a full range of probing formats, providing superior accuracy and automation in a wide range of testing environments. In addition to the 4090, DPS II will be offered as a fully compatible, integrated option for Electroglas' Horizon 4080X(R) and Horizon 4060X(R) probers.

To the extent that this news release discusses expectations about market conditions or market acceptance and future sales of our products, or otherwise makes statements about the future, such statements are forward looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made.

These factors include the cyclical nature of the semiconductor industry, risks associated with the acceptance of new products, and other factors discussed in the business description and management's discussion and analysis sections of the company's report on Form 10K and annual report to shareholders.

About Electroglas

Founded in 1960, Electroglas Inc. is a world-leading supplier of the automated wafer-probing products that semiconductor manufacturers rely on to sort and classify integrated circuits. The company's products position semiconductor devices that are still in wafer form under contact probes to facilitate accurate, rapid, reliable testing and manage information collected during the testing process.

Electroglas' common stock is traded on the Nasdaq Stock Market under the trading symbol EGLS. Its home page on the World Wide Web is located at http://www.electroglas.com

CONTACT: Electroglas Inc., Santa Clara

Yolanda Ruiz, 408/727-6500

or

MCA Inc.

Lisa Gillette, 415/968-8900