Electroglas Introduces 300-mm Wafer Inspection System With Flexible Material Handling.Business Editors/High Tech Writers SEMICON SEMICON Semiconductors Equipment and Material International Conference West 2001 SAN FRANCISCO--(BUSINESS WIRE)--July 16, 2001 QuickSilver quicksilver: see mercury. (1) (QuickSilver Technology, Inc., San Jose, CA, www.qstech.com) A mobile communications company that specializes in a reconfigurable logic chip for cellphones and PDAs. See adaptive computing. IIIe expands wafer inspection applications to ultra-thin wafer handling and front-end quality assurance inspection Electroglas, Inc. (NASDAQ NASDAQ in full National Association of Securities Dealers Automated Quotations U.S. market for over-the-counter securities. Established in 1971 by the National Association of Securities Dealers (NASD), NASDAQ is an automated quotation system that reports on :EGLS EGLS Eastside German Language School (Issaquah, WA) ), a leading supplier of process management tools for the semiconductor industry, today at SEMICON West introduces the QuickSilver IIIe(TM) inspection system for the automatic identification and classification of 1 micrometer micrometer (mīkrŏm`ətər, mī`krōmē'tər). 1 Instrument used for measuring extremely small distances. and larger defects on processed 300-mm and 200-mm semiconductor wafers. The tool is capable of quality assurance (QA) inspection of 100 percent of die on wafers and ultra-thin wafer handling inspection, as well as solder bump, gold bump and MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. inspection. QuickSilver IIIe provides for easy configuration of single or multiple front-opening unified pods (FOUPs), standard thickness wafer handling or ultra-thin wafer thickness on film-frame and field-upgrade technology modules. The tool is based on an Advanced Imaging Platform (AIP AIP acute intermittent porphyria. AIP Acute intermittent porphyria (TM)) that permits wafer inspection on complex final wafer patterns prior to electrical test and assembly through and including an ultra-thinning process step required for emerging chip packages. "The QuickSilver IIIe capitalizes on the experience of earlier models to provide our customers with inspection application flexibility and material handling," said John R. Dralla, vice president of marketing and sales at Electroglas' Inspection Products division. "The evolution to 300-mm allowed us to provide a solution to finished wafer fabrication Wafer Fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. quality. Now IDMs or contract manufacturers can inspect the quality of wafers they manufacture or receive, from the completion of wafer fabrication through and including an ultra-thinning step. QuickSilver IIIe provides the long awaited bridge between the manual microscope and the very expensive wafer fab inspection system." Like the QuickSilver IIe, the tool screens such flaws as passivation passivation the final stage in instrument manufacture, passing the finished instruments through a bath of nitric acid which removes foreign particles and promotes the formation of a protective coating of chromium oxide. voids, scratches and debris on the surface of wafers, and provides precise metrology data on critical bump dimensions including height, volume, shape and placement. The tool also examines and provides detailed analyses of probe marks. The AIP incorporates a dedicated multi-processor computer, fiber-optic link, proprietary TDI TDI - Transport Driver Interface CCD CCD in full charge-coupled device Semiconductor device in which the individual semiconductor components are connected so that the electrical charge at the output of one device provides the input to the next device. scanning camera, and an ultra-high-capacity buffer for capturing comprehensive images of even the largest die. QuickSilver IIIe is supported by QuickLook(TM), which is an offline software tool for enhanced visualization of die, wafer and lot data. QuickLook allows detailed analyses and comparison of defect data by organizing and presenting wafer maps, defect maps, measurement files and images from one or multiple QuickSilver IIIe inspection systems. QuickSilver IIIe data is fully integrated with test electrical data via YieldManager(TM), SORTnet(R) and other Electroglas networking and process-management software. For more information, contact the Electroglas Inspection Products Division in Corvallis, Oregon at (541) 738-2200 or visit www.electroglas.com. About Electroglas, Inc. Electroglas delivers essential tools for process management to enhance the profitability of semiconductor manufacturers. The company's wafer probers, inspection systems and software solutions serve as data collection, management and analysis tools that semiconductor manufacturers depend upon to improve their productivity and process control by optimizing sort-floor efficiency. Electroglas has been a leading supplier of wafer probers for over 40 years and has an installed base of more than 15,000 systems. The company's stock trades on the NASDAQ National Market under the symbol "EGLS". The company's World Wide Web site is located at www.electroglas.com. QuickSilver, QuickLook and YieldManager are trademarks of Electroglas, Inc. SORTnet is a registered trademark of Electroglas, Inc. All product names mentioned in this document are trademarks or registered trademarks of their respective holders. |
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