Electroglas Inspection Products Introduces Process Visualization Workstation; QuickLook Workstation Helps Characterize and Manage Wafer Bumping Processes.

Business Editors and High Tech Writers

SANTA CLARA, Calif.--(BUSINESS WIRE)--Feb. 9, 2000

The Inspection Products division of Electroglas, Inc. (NASDAQ:EGLS), a leading supplier of essential process management tools for the semiconductor industry, today introduces QuickLook(TM), a process visualization workstation for analyses of bumped wafer inspection data and images from QuickSilver(TM) Bump Inspection Systems on the production floor.

QuickLook simplifies the development and management of wafer bumping processes by facilitating comparisons of bump height, position, area, roundness and volume within and among die, wafers and lots. QuickLook also presents several types of maps from each wafer in a lot, coloring defective die according to their bin codes and graphically revealing the position and type of every defective bump in a lot. Together, QuickSilver and QuickLook achieve near engineering metrology quality data for process management at full production inspection speed.

QuickLook enables detailed analyses of bump fabrication data provided by QuickSilver inspection systems by organizing and presenting wafer maps, defect maps, measurement files and images. Various formatting options allow a process engineer to easily visualize hundreds of megabytes of data from one or more QuickSilver inspection systems in order to make expert process decisions.

QuickLook pulls data and images from multiple QuickSilvers. It collects all the measurements of defective bumps and can archive the bump images for side-by-side review in a browser with the wafer maps, bump measurement data and the automated defect classifications. Bump measurements can be taken from repeated runs of the same wafer product, over extended time if desired, to study tool repeatability. Process variations can be studied by visualizing and correlating data taken from many wafers.

QuickLook can export data for analysis in spreadsheets or graphs. For instance, each bump height measurement on a die can be plotted to study bump coplanarity. Average bump height measurements and standard deviations for each die on a single wafer can be plotted as a surface showing characteristic bumping process variation across a wafer. Measurement of a particular bump on a die can be compared with other die, even across many wafers, to reveal bump mask and other process problems. Process trends and problems can be readily identified by displays and graphs that QuickLook can create from QuickSilver bump inspection data, making the tools in combination an essential resource for managing wafer bumping processes.

For more information about QuickLook, please contact the Electroglas Inspection Products Division in Corvallis, Oregon at [phone] or visit www. electroglas.com.

About Electroglas, Inc.

Electroglas delivers essential tools for process management to enhance the profitability of semiconductor manufacturers. The company's wafer probers, inspection systems and software solutions serve as data collection, management and analysis tools that semiconductor manufacturers depend upon to improve their productivity and process control by optimizing sort-floor efficiency. Electroglas has been a leading supplier of wafer probers for over 35 years and has an installed base of more than 10,000 systems. The company's stock trades on the NASDAQ National Market under the symbol &uot;EGLS&uot;. The company's World Wide Web site is located at www.electroglas.com.