EV Group Ships Gemini Production Wafer Bonder to DALSA for Volume MEMS Production.SCHARDING, Austria -- EV Group, a leading supplier of wafer-bonding equipment for MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. , 3D interconnects and micro devices, today announced that it has successfully installed a Gemini Production Wafer Bonder at DALSA Corporation, a premium supplier of specialized and custom wafer-foundry services. The Gemini Production Wafer Bonder is designed for alignment and low-temperature plasma bonding for a wide variety of wafer types and sizes. DALSA's semiconductor division, which is based in Bromont, Quebec Bromont is a city in southwestern Quebec in Canada, 75 kilometres (47 mi) east of Montreal on Autoroute 10, bordering the Eastern Townships at the base of Mount Brome (Mont Brome). , Canada, will use the Gemini Production Wafer Bonder to leverage its patented and patent-pending low-temperature wafer bonding and wafer-level packaging technologies. The production tool's flexibility will also enable the company to implement these and other strategies for very low-temperature direct-wafer bonding of CMOS-friendly substrates, further enhancing DALSA's intelligent-MEMS capabilities. As the strategic supplier for MEMS wafer-bonding and thick-polymer lithography semiconductor production equipment for DALSA, EV Group previously installed a Hercules thick-polymer lithography tool customized for DALSA's specifications at its foundry in Bromont. The Hercules system has been qualified to process advanced chemically amplified thick photopolymers for its MEMS processes involving DRIE v. t. 1. To endure. So causeless such drede for to drie. - Chaucer. , electroforming Electroforming is a highly specialized process of metal part fabrication using electrodeposition in a plating bath over a base form or mandrel which is subsequently removed. and wafer bonding. The Hercules is a customizable system for MEMS production that integrates coat/align-expose/develop stations for fully automated and integrated production. "EV Group's fully automated Gemini Wafer Bonder cluster tool and Hercules lithography system enable DALSA to use its proprietary CMOS-friendly electroformed lead-free eutectic solders, EV Group's LowTemp plasma-activated bonding, low temperature thermo-compression and other CMOS-friendly and proprietary low temperature wafer bonding technologies to address the most demanding intelligent-MEMS and 3D interconnects for our IDM (1) See identity management. (2) (Integrated Device Manufacturer) A company that performs every step of the chip-making process, including design, manufacture, test and packaging. Examples of IDMs are Intel, AMD, Motorola, IBM, TI and Lucent. , fab-lite and fabless semiconductor customers," said Luc Ouellet, DALSA Semiconductor's director of technology. "The precision of EV Group's SmartView wafer-to-wafer alignment allows high-end CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. DSP (1) (Digital Signal Processor) A special-purpose CPU used for digital signal processing applications (see definition #2 below). It provides ultra-fast instruction sequences, such as shift and add, and multiply and add, which are commonly used in math-intensive to be used to its full potential to create truly intelligent-MEMS using 3D interconnects. In addition, we are able to offer our customers volume production pricing by using this fully automated Gemini Wafer Bonder cluster tool in combination with our other customized, high-throughput automated MEMS production tools, which will open up new opportunities in the automotive, industrial, RF-telecom, photonics, information technologies and biomedical bi·o·med·i·cal adj. 1. Of or relating to biomedicine. 2. Of, relating to, or involving biological, medical, and physical sciences. MEMS market segments." "DALSA is a key member of EV Group's growing customer base for MEMS production, nanotechnology and other emerging fields in North America," said Dr. Peter Podesser, chief executive officer of EV Group. "As part of this collaboration between EV Group and DALSA, we will enhance the capabilities of the equipment sub-modules to handle new materials and processes." About DALSA Corporation DALSA is an international high performance semiconductor and electronics company that designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing wafer foundry services. DALSA's core competencies are in specialized integrated circuit and electronics technology, and highly engineered semiconductor wafer processing. Products include image sensor components; electronic digital cameras; and semiconductor wafer foundry services for use in MEMS, high-voltage semiconductors, image sensors and mixed-signal CMOS chips. DALSA is a public company listed on the Toronto Stock Exchange Toronto Stock Exchange (TSE) Canada's largest stock exchange, trading approximately 1,200 company stocks and 33 options. under the symbol "DSA (1) (Directory Server Agent) An X.500 program that looks up the address of a recipient in a Directory Information Base (DIB), also known as white pages. It accepts requests from the Directory User Agent (DUA) counterpart in the workstation. ". Based in Waterloo, ON. Canada, the company has operations in Bromont, PQ; Colorado Springs, CO; Woodland Hills, CA; Eindhoven, NL; Munich, Germany and Tokyo, Japan. About EV Group Founded in 1980, EV Group is a global supplier of wafer bonders, aligners, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding equipment (especially SOI (Silicon On Insulator) A chip architecture that increases transistor switching speed by reducing capacitance (build-up of electrical charges in the transistor's elements), and thus reducing the discharge time. The power requirement is also reduced in some designs. bonding) and is a leader in lithography for advanced packaging, MEMS and nanotechnology. The company's unique Triple I approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EV Group to respond quickly to new technology development, apply the technology to manufacturing challenges and expedite volume production. Headquartered in Scharding, Austria, EV Group operates via a global customer support network, with subsidiaries in Phoenix, Arizona; Cranston, Rhode Island Cranston, once known as Pawtuxet, is a city in Providence County, Rhode Island, United States. With a population of 79,269 as of the 2000 census, it is the third largest city in the state. The center of population of Rhode Island is located in Cranston [2]. ; Yokohama, Japan; and Chung-Li, Taiwan. EV Group has built up a strong local organization in China with representative offices in Beijing, Shanghai and Shenzen. For more information, visit www.EVGroup.com. |
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