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ESSEM TEC: production equipment for electronics.


LEAD FREE SOLDERING soldering

Process that uses metal alloys with low melting points to join metallic surfaces without melting them. Tin-lead solders, once widely used in the electrical and plumbing industries, are now replaced by lead-free alloys.
 

ESSEMTEC--the leading Swiss manufacturer of low/midsize volume production equipment presents the latest technology in lead free capable REFLOW OVENS A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards. Types of Reflow Ovens
Infrared and Convection Ovens
.

RO300FC

Table top or stand alone full convection reflow oven with lowest delta-T values for perfect soldering results. The ideal system for small in house productions or contract manufacturers.

[ILLUSTRATION OMITTED]

RO400FC

Stand alone or inline full convection reflow oven with mesh belt or pin conveyor Conveyor

A horizontal, inclined, declined, or vertical machine for moving or transporting bulk materials, packages, or objects in a path predetermined by the design of the device and having points of loading and discharge fixed or selective.
 with optional middle support and SMEMA SMEMA Surface Mount Equipment Manufacturers Association (Association of SMT board assemblers)  interface.

[ILLUSTRATION OMITTED]

www.essemtec.com

Phone: 856-218-1131
COPYRIGHT 2004 UP Media Group, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2004, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Title Annotation:Assembly Insider: Special Advertising Section
Publication:Circuits Assembly
Article Type:Advertisement
Date:Jul 1, 2004
Words:83
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